Inventor · disambiguated record
Seungwon Kim
Also filed as: KIM SEUNGWON
16 granted patents·5 pending applications·82 citations·filing 2008–2025
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD6SAMSUNG DISPLAY CO LTD3LG ELECTRONICS INC2HYUNDAI MOTOR CO LTD1KIM OHHAN1
Top patents by PatentIndex Score
21 records- 0191US8804039B2Display apparatus and method for controlling the display apparatusKIM SEUNGWON·Filed 2011·Granted Aug 12, 2014·36 cites·22 claims
- 0289US9578272B2Display apparatus and method for controlling the display apparatusLG ELECTRONICS INC·Filed 2015·Granted Feb 21, 2017·7 cites·19 claims
- 0387US10771736B2Compositing and transmitting contextual information during an audio or video callMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2014·Granted Sep 8, 2020·8 cites·20 claims
- 0484US8409918B2Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mountingYANG DAEWOOK·Filed 2010·Granted Apr 2, 2013·9 cites·22 claims
- 0584US2025376754A1Mask manufacturing equipment and method of manufacturing mask using the sameSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 0681US9041862B2Display apparatus and method for controlling the display apparatusLG ELECTRONICS INC·Filed 2014·Granted May 26, 2015·5 cites·20 claims
- 0778US8877567B2Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor dieLEE KYUNGHOON·Filed 2010·Granted Nov 4, 2014·7 cites·17 claims
- 0876US12360457B2Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0975US9123663B2Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductorKIM OHHAN·Filed 2008·Granted Sep 1, 2015·8 cites·24 claims
- 1066US12044974B2Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 1164US12416072B2Mask manufacturing equipment and method of manufacturing mask using the sameSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Sep 16, 2025·0 cites·15 claims
- 1262US2023043670A1Cavity noise reduction tireKUMHO TIRE CO INC·Filed 2022·Application pending·0 cites
- 1361US8836097B2Semiconductor device and method of forming pre-molded substrate to reduce warpage during die moldingSTATS CHIPPAC LTD·Filed 2013·Granted Sep 16, 2014·1 cites·26 claims
- 1461US2025257218A1Compositions for near-infrared light-blocking filters, and image sensors including near-infrared light-blocking filtersSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1558US2024315060A1Photoelectric conversion device and image sensor including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1657US9586467B2Coreless engine mount and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2013·Granted Mar 7, 2017·1 cites·7 claims
- 1752US11776972B2Method and apparatus for manufacturing mask assembly and method of manufacturing display deviceSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·19 claims
- 1845US10199366B2Methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 5, 2019·0 cites·9 claims
- 1942US11579538B2Load port unit, storage apparatus including the same, and exhaust methodSEMES CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·12 claims
- 2042US11219568B2Standing assistance apparatusKOREA INST SCI & TECH·Filed 2018·Granted Jan 11, 2022·0 cites·12 claims
- 2139US2016215085A1Methods of Purifying a Block Copolymer and Methods of Forming a Pattern Using the Block CopolymerSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →