Inventor · disambiguated record
Seungmin Kim
Also filed as: KIM SEUNGMIN
6 granted patents·13 pending applications·2 citations·filing 2007–2025
69Inventor score
Top patents by PatentIndex Score
19 records- 0180US12381090B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Aug 5, 2025·1 cites·20 claims
- 0276US11810865B2Semiconductor package with marking patternSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·1 cites·19 claims
- 0373US2025391820A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0471US2025336682A1Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0567US12002763B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 0658US12476443B2High voltage junction block and vehicle including the sameHYUNDAI MOTOR CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·17 claims
- 0758US12412875B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 0858US2025196679A1Vehicle charging device and vehicle charging methodHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0957US2024274581A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1055US2025319829A1Grommet and vehicle including the sameHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1155US2025118681A1Semiconductor package, electronic device including the semiconductor package and method of manufacturing the electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1253US11552022B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 1351US2024006411A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1449US2025368161A1Method of controlling vehicle doorHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1546US2023106013A1Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1644US2022399322A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1742US2023260888A1Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1840US2008068301A1Plasma display device and driving method thereofKIM SEUNGMIN·Filed 2007·Application pending·0 cites
- 1940US2008122746A1Plasma display panel and driving method thereofKIM SEUNGMIN·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →