Inventor · disambiguated record
Seongyo Kim
Also filed as: KIM SEONGYO
1 granted patent·6 pending applications·0 citations·filing 2022–2024
13Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0161US12469810B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 0256US2025070072A1Semiconductor package comprising dam and multi-layered under-fill layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0355US2025323216A1Semiconductor stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0455US2025062210A1Semiconductor package comprising dummy structure at corner region thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0551US2024128221A1Semiconductor package including bumps with a plurality of separation distancesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0649US2024186289A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0749US2024162193A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →