Inventor · disambiguated record
Seishi Kumamoto
Also filed as: KUMAMOTO SEISHI
4 granted patents·2 pending applications·112 citations·filing 1994–2010
79Inventor score
Top patents by PatentIndex Score
6 records- 0185US5453582ACircuit board to be precoated with solder layers and solder circuit boardFURUKAWA ELECTRIC CO LTD·Filed 1995·Granted Sep 26, 1995·70 cites·14 claims
- 0273US7452797B2Solder deposition method and solder bump forming methodHARIMA CHEMICALS INC·Filed 2004·Granted Nov 18, 2008·24 cites·15 claims
- 0370US7503958B2Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powderHARIMA CHEMICALS INC·Filed 2006·Granted Mar 17, 2009·4 cites·6 claims
- 0448US5601228ASolder-precipitating composition and mounting method using the compositionFURUKAWA ELECTRIC CO LTD·Filed 1994·Granted Feb 11, 1997·14 cites·9 claims
- 0531US2012291922A1Solder pasteIWAMURA EIJI·Filed 2010·Application pending·0 cites
- 0630US2012291921A1Flux for solder paste, and solder pasteIWAMURA EIJI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →