Inventor · disambiguated record
Sean Kupcow
Also filed as: KUPCOW SEAN
25 granted patents·3 pending applications·93 citations·filing 2015–2022
95Inventor score
Top patents by PatentIndex Score
28 records- 0199US9633883B2Apparatus for transfer of semiconductor devicesROHINNI LLC·Filed 2015·Granted Apr 25, 2017·34 cites·9 claims
- 0298US9871023B2Method for transfer of semiconductor devicesROHINNI LLC·Filed 2016·Granted Jan 16, 2018·21 cites·7 claims
- 0397US10615152B2Semiconductor device on glass substrateROHINNI LLC·Filed 2017·Granted Apr 7, 2020·7 cites·6 claims
- 0496US10141215B2Compliant needle for direct transfer of semiconductor devicesROHINNI LLC·Filed 2016·Granted Nov 27, 2018·13 cites·20 claims
- 0593US10615153B2Apparatus for direct transfer of semiconductor device dieROHINNI LLC·Filed 2018·Granted Apr 7, 2020·2 cites·7 claims
- 0693US10373937B2Apparatus for multi-direct transfer of semiconductorsROHINNI LLC·Filed 2017·Granted Aug 6, 2019·4 cites·20 claims
- 0792US10062588B2Flexible support substrate for transfer of semiconductor devicesROHINNI LLC·Filed 2017·Granted Aug 28, 2018·7 cites·20 claims
- 0891US10566319B2Apparatus for direct transfer of semiconductor device dieROHINNI LLC·Filed 2019·Granted Feb 18, 2020·1 cites·20 claims
- 0987US10490532B2Apparatus and method for direct transfer of semiconductor devicesROHINNI LLC·Filed 2017·Granted Nov 26, 2019·2 cites·7 claims
- 1087US9985003B2Substrate with array of LEDs for backlighting a display deviceROHINNI LLC·Filed 2016·Granted May 29, 2018·2 cites·14 claims
- 1176US11515293B2Direct transfer of semiconductor devices from a substrateROHINNI LLC·Filed 2020·Granted Nov 29, 2022·0 cites·7 claims
- 1276US11488940B2Method for transfer of semiconductor devices onto glass substratesROHINNI LLC·Filed 2020·Granted Nov 1, 2022·0 cites·7 claims
- 1376US10910354B2Apparatus for direct transfer of semiconductor device dieROHINNI LLC·Filed 2020·Granted Feb 2, 2021·0 cites·18 claims
- 1476US10622337B2Method and apparatus for transfer of semiconductor devicesROHINNI LLC·Filed 2017·Granted Apr 14, 2020·0 cites·8 claims
- 1575US11562990B2Systems for direct transfer of semiconductor device dieROHINNI LLC·Filed 2019·Granted Jan 24, 2023·0 cites·20 claims
- 1675US10636770B2Apparatus and method for direct transfer of semiconductor devices from a substrate and stacking semiconductor devices on each otherROHINNI LLC·Filed 2017·Granted Apr 28, 2020·0 cites·7 claims
- 1772US11152339B2Method for improved transfer of semiconductor dieROHINNI LLC·Filed 2019·Granted Oct 19, 2021·0 cites·8 claims
- 1870US10290615B2Method and apparatus for improved direct transfer of semiconductor dieROHINNI LLC·Filed 2018·Granted May 14, 2019·0 cites·6 claims
- 1970US10242971B2Apparatus for direct transfer of semiconductor devices with needle retraction supportROHINNI LLC·Filed 2018·Granted Mar 26, 2019·0 cites·11 claims
- 2069US10170454B2Method and apparatus for direct transfer of semiconductor device die from a mapped waferROHINNI LLC·Filed 2018·Granted Jan 1, 2019·0 cites·8 claims
- 2169US2018301439A1Substrate with Array of LEDs for Backlighting a Display DeviceROHINNI LLC·Filed 2018·Application pending·0 cites
- 2268US10325885B2Semiconductor device on string circuit and method of making the sameROHINNI LLC·Filed 2017·Granted Jun 18, 2019·0 cites·7 claims
- 2359US11069551B2Method of dampening a force applied to an electrically-actuatable elementROHINNI LLC·Filed 2018·Granted Jul 20, 2021·0 cites·20 claims
- 2457US10354895B2Support substrate for transfer of semiconductor devicesROHINNI LLC·Filed 2018·Granted Jul 16, 2019·0 cites·15 claims
- 2551US12040207B2Apparatus and method for orientation of semiconductor device dieROHINNI INC·Filed 2021·Granted Jul 16, 2024·0 cites·18 claims
- 2646US12230519B2Method and apparatus for multiple axis direct transfers of semiconductor devicesCOWLES SEMI LLC·Filed 2022·Granted Feb 18, 2025·0 cites·6 claims
- 2738US2018248090A1Semiconductor Device Circuit Apparatus Bonded with Anisotropic Conductive Film and Method of Direct Transfer for Making the SameROHINNI LLC·Filed 2017·Application pending·0 cites
- 2832US2018331079A1Waterproof sealed circuit apparatus and method of making the sameROHINNI LLC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →