Substrate with Array of LEDs for Backlighting a Display Device

Abstract

A circuit component for a display includes a substrate and a circuit trace having a predetermined pattern disposed on a surface of the substrate. A plurality of semiconductor die are connected to the substrate via the circuit trace. The plurality of semiconductor die are distributed across the surface of the substrate. One or more substrate orientation datum points are disposed on the substrate. The substrate orientation datum points are readable via a sensor of an apparatus that performs a transfer of the plurality of semiconductor die from a supply of die. The substrate orientation datum points provide information regarding positions on the circuit trace. The positions correspond to transfer locations for the plurality of semiconductor die, respectively.

What is claimed is: 
     
         1 . A circuit component for a display, comprising:
 a substrate;   a circuit trace having a predetermined pattern disposed on a surface of the substrate;   a plurality of semiconductor die connected to the substrate via the circuit trace, the plurality of semiconductor die being distributed across the surface of the substrate; and   one or more substrate orientation datum points disposed on the substrate, the substrate orientation datum points being readable via a sensor of an apparatus that performs a transfer of the plurality of semiconductor die from a supply of die, and the substrate orientation datum points providing information regarding positions on the circuit trace, the positions corresponding to transfer locations for the plurality of semiconductor die, respectively.   
     
     
         2 . The circuit component according to  claim 1 , wherein the circuit trace is a conductive ink and a thickness of the circuit trace ranges from about 5 microns to about 20 microns. 
     
     
         3 . The circuit component according to  claim 1 , wherein the predetermined pattern includes an array of lines along the surface of the substrate. 
     
     
         4 . The circuit component according to  claim 1 , wherein a material of the substrate includes a polymer. 
     
     
         5 . The circuit component according to  claim 1 , wherein the polymer includes one of a polyester, an acrylic, a polyimide, or a polycarbonate. 
     
     
         6 . The circuit component according to  claim 1 , wherein a height of the plurality of semiconductor die ranges from about 12.5 microns to about 200 microns. 
     
     
         7 . The circuit component according to  claim 1 , wherein the plurality of semiconductor die are electrically interconnected via the circuit trace. 
     
     
         8 . The circuit component according to  claim 1 , wherein the circuit trace includes a silver-coated copper particle. 
     
     
         9 . The circuit component according to  claim 1 , wherein a height of the plurality of semiconductor die ranges from about 25 microns to no greater than 100 microns. 
     
     
         10 . The circuit component according to  claim 1 , wherein the plurality of semiconductor die includes LEDs. 
     
     
         11 . A circuit component for a display, comprising:
 a substrate;   a circuit trace having a predetermined pattern disposed on a surface of the substrate;   a plurality of unpackaged micro-sized LEDs connected to the substrate via the circuit trace, the plurality of unpackaged micro-sized LEDs being distributed across the surface of the substrate; and   one or more substrate orientation datum points disposed on the substrate, the substrate orientation datum points being readable via a sensor of an apparatus that performs a transfer of the plurality of unpackaged micro-sized LEDs from a supply of unpackaged micro-sized LEDs, and the substrate orientation datum points providing information regarding positions on the circuit trace, the positions corresponding to transfer locations for the plurality of unpackaged micro-sized LEDs, respectively.   
     
     
         12 . A circuit component, comprising:
 a substrate;   a circuit trace disposed on a surface of the substrate;   a plurality of unpackaged LEDs connected to the substrate via the circuit trace; and   one or more substrate orientation datum points disposed on the substrate,   wherein the circuit component is formed by a method including:   using the one or more substrate orientation datum points to orient at least one of the surface of the substrate or an unpackaged LED of the plurality of unpackaged LEDs such that the circuit trace is aligned for a transfer of the unpackaged LED to the circuit trace, and   attaching the unpackaged LED to the substrate, and   wherein the substrate orientation datum points are readable via a sensor of an apparatus that performs the method, the substrate orientation datum points providing information regarding positions of the circuit trace on the substrate, thereby indicating a plurality of transfer locations for the plurality of unpackaged LEDs, respectively.