Inventor · disambiguated record
Seung Yeop Lee
Also filed as: LEE SEUNG YEOP
24 granted patents·16 pending applications·31 citations·filing 2009–2024
92Inventor score
Files withSK HYNIX INC12HYUNDAI MOTOR CO LTD6KOREA ATOMIC ENERGY RES5LEE SEUNG YEOP3HANWHA TOTAL PETROCHEMICAL CO LTD2
Top patents by PatentIndex Score
40 records- 0192US10262972B2Semiconductor packages including stacked chipsSK HYNIX INC·Filed 2017·Granted Apr 16, 2019·12 cites·12 claims
- 0284US12479102B2Apparatus and method for piston insertionHYUNDAI MOTOR CO LTD·Filed 2021·Granted Nov 25, 2025·1 cites·15 claims
- 0377US11164833B2Semiconductor device using wires and stacked semiconductor packageSK HYNIX INC·Filed 2020·Granted Nov 2, 2021·1 cites·16 claims
- 0477US2025364582A1Battery cell reversal deviceHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0574US8616875B2Light guide plate stamp and method of manufacturing the sameRYU HO-HAN·Filed 2011·Granted Dec 31, 2013·2 cites·11 claims
- 0674US8233015B2Display apparatus and method of manufacturing the sameLEE SEUNG-YEOP·Filed 2009·Granted Jul 31, 2012·5 cites·12 claims
- 0773US9397024B2Semiconductor devices with optical through via structures, memory cards including the same, and electronic systems including the sameSK HYNIX INC·Filed 2014·Granted Jul 19, 2016·3 cites·18 claims
- 0872US9034614B2Method of preparing alkyl butyrate from fermented liquid using microorganismsKANG SIN YOUNG·Filed 2011·Granted May 19, 2015·2 cites·6 claims
- 0971US12065951B2Apparatus and method for assembling an engineHYUNDAI MOTOR CO LTD·Filed 2022·Granted Aug 20, 2024·0 cites·19 claims
- 1071US9184137B2Semiconductor chip and semiconductor package having the sameSK HYNIX INC·Filed 2013·Granted Nov 10, 2015·3 cites·21 claims
- 1169US2025340185A1Method of controlling a vehicle interior sterilization apparatusHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1268US11004831B2Stack packages including a fan-out sub-packageSK HYNIX INC·Filed 2019·Granted May 11, 2021·1 cites·20 claims
- 1365US11759897B2Part assembling system of automation lineHYUNDAI MOTOR CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·17 claims
- 1461US2023279164A1Polymerization Method Of Ultra High Molecular Weight Polyethylene And Method For Preparing Catalyst ThereofHANWHA TOTALENERGIES PETROCHEMICAL CO LTD·Filed 2023·Application pending·0 cites
- 1560US11742340B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2021·Granted Aug 29, 2023·0 cites·21 claims
- 1659US9181114B2Mineralogical removal method and apparatus for highly concentrated iodine in radioactive wastewaterKOREA ATOMIC ENERGY RES·Filed 2014·Granted Nov 10, 2015·0 cites·4 claims
- 1758US2021189026A1Preparation Method Of Catalyst For Ethylene PolymerizationHANWHA TOTAL PETROCHEMICAL CO LTD·Filed 2020·Application pending·0 cites
- 1858US2021187491A1Preparation Method Of Catalyst For Ethylene PolymerizationHANWHA TOTAL PETROCHEMICAL CO LTD·Filed 2020·Application pending·0 cites
- 1957US7999370B2Semiconductor chip capable of increased number of pads in limited region and semiconductor package using the sameHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Aug 16, 2011·1 cites·24 claims
- 2056US2024038073A1Method and apparatus for providing flight vehicle operation informationPABLO AIR CO LTD·Filed 2023·Application pending·0 cites
- 2156US2024029575A1Method and apparatus for controlling operations of flight vehiclesPABLO AIR CO LTD·Filed 2023·Application pending·0 cites
- 2254US11309098B2Mineralogical method and apparatus for removal of aqueous cesium ionKOREA ATOMIC ENERGY RES·Filed 2020·Granted Apr 19, 2022·0 cites·13 claims
- 2350US11309303B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2021·Granted Apr 19, 2022·0 cites·14 claims
- 2450US2015076045A1Purification method and apparatus for radioactive wastewater containing iodine radionuclidesKOREA ATOMIC ENERGY RES·Filed 2013·Application pending·0 cites
- 2548US12493309B2Internal reference voltage generation deviceSK HYNIX INC·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 2647US10337035B2Method for preparing organic acid by fed-batch-feeding carbon source substrate and baseSK INNOVATION CO LTD·Filed 2013·Granted Jul 2, 2019·0 cites·9 claims
- 2747US2011163028A1Biofilm Reactor Containing Spiral Structure and Water Treatment Device Using the SameHWANG SEOK HWAN·Filed 2009·Application pending·0 cites
- 2847US2025266181A1Apparatus and method to remove tritium from high volumetric wastewatersKOREA ATOMIC ENERGY RES·Filed 2022·Application pending·0 cites
- 2945US11195827B2Semiconductor integrated circuit device including an electro-static discharge protection circuitSK HYNIX INC·Filed 2019·Granted Dec 7, 2021·0 cites·13 claims
- 3044US11152335B2Stack packages including a supporting substrateSK HYNIX INC·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
- 3144US2015231085A1Pharmaceutical composite capsule formulation comprising irbesartan and hmg-coa reductase inhibitorHANMI PHARM IND CO LTD·Filed 2013·Application pending·0 cites
- 3244US2015004674A1Method for removing radionuclides using microalgaeUNIV SOGANG RES FOUNDATION·Filed 2014·Application pending·0 cites
- 3344US2018002210A1Biomineralogical method and apparatus for removing cesium ionsKOREA ATOMIC ENERGY RES·Filed 2017·Application pending·0 cites
- 3442US2018066602A1Engine having shearing resistance reduction patternsHYUNDAI MOTOR CO LTD·Filed 2016·Application pending·0 cites
- 3541US8816360B2Multi-chip package cross-reference to related applicationsLEE SEUNG YEOP·Filed 2012·Granted Aug 26, 2014·0 cites·9 claims
- 3640US9888567B2Flexible device including sliding interconnection structureSK HYNIX INC·Filed 2016·Granted Feb 6, 2018·0 cites·14 claims
- 3737US11158626B2Semiconductor integrated circuit device including an electrostatic discharge protection circuitSK HYNIX INC·Filed 2018·Granted Oct 26, 2021·0 cites·13 claims
- 3835US8772937B2Semiconductor device including inner interconnection structure able to conduct signals or voltages in the semiconductor chip with vertical connection vias and horizontal buried conductive linesSEO HYUN CHUL·Filed 2011·Granted Jul 8, 2014·0 cites·17 claims
- 3935US2012286398A1Semiconductor chip module and planar stack package having the sameLEE SEUNG YEOP·Filed 2011·Application pending·0 cites
- 4032US2012205672A1Semiconductor chip module and semiconductor pacakge having the sameSEO HYUN CHUL·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →