Inventor · disambiguated record
Severino A. Legaspi, Jr.
Also filed as: LEGASPI JR SEVERINO A · LEGASPI SEVERINO
6 granted patents·1 pending application·76 citations·filing 2002–2013
80Inventor score
Top patents by PatentIndex Score
7 records- 0182US6933602B1Semiconductor package having a thermally and electrically connected heatspreaderLSI LOGIC CORP·Filed 2003·Granted Aug 23, 2005·38 cites·12 claims
- 0279US6867480B2Electromagnetic interference package protectionLSI LOGIC CORP·Filed 2003·Granted Mar 15, 2005·29 cites·20 claims
- 0355US6603201B1Electronic substrateLSI LOGIC CORP·Filed 2002·Granted Aug 5, 2003·6 cites·16 claims
- 0445US7436060B2Semiconductor package and process utilizing pre-formed mold cap and heatspreader assemblyLSI CORP·Filed 2004·Granted Oct 14, 2008·2 cites·14 claims
- 0540US6777803B2Solder mask on bonding ringLSI LOGIC CORP·Filed 2002·Granted Aug 17, 2004·1 cites·20 claims
- 0640US2014260650A1Silicon plate in plastic packageSILICON MICROSTRUCTURES INC·Filed 2013·Application pending·0 cites
- 0738US6801437B2Electronic organic substrateLSI LOGIC CORP·Filed 2003·Granted Oct 5, 2004·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →