Inventor · disambiguated record
Ser Bok Leng
Also filed as: LENG SER B · LENG SER BOK
11 granted patents·1 pending application·217 citations·filing 2002–2010
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0195US7358154B2Method for fabricating packaged dieMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 15, 2008·30 cites·24 claims
- 0294US6894386B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted May 17, 2005·69 cites·30 claims
- 0391US6836009B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·51 cites·53 claims
- 0484US7675169B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 9, 2010·9 cites·20 claims
- 0583US7195957B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 27, 2007·25 cites·6 claims
- 0677US8138617B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2004·Granted Mar 20, 2012·19 cites·15 claims
- 0766US6836008B2Semiconductor packages with leadframe grid arrays and componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·10 cites·52 claims
- 0865US7170161B2In-process semiconductor packages with leadframe grid arraysMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·2 cites·20 claims
- 0959US8115306B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2010·Granted Feb 14, 2012·1 cites·20 claims
- 1051US2007120247A1Semiconductor packages having leadframe-based connection arraysYU CHAN M·Filed 2007·Application pending·0 cites
- 1146US6967127B2Methods for making semiconductor packages with leadframe grid arraysMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 22, 2005·1 cites·19 claims
- 1245US8637973B2Packaged microelectronic components with terminals exposed through encapsulantKOON ENG MEOW·Filed 2007·Granted Jan 28, 2014·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →