Inventor · disambiguated record
Seiichi Miyazaki
Also filed as: MIYAZAKI SEIICHI
22 granted patents·3 pending applications·307 citations·filing 1976–2014
95Inventor score
Files withSHINETSU HANDOTAI KK6PANASONIC IP MAN CO LTD5OKURA DENKI CO LTD4UNIV HIROSHIMA4TOSHIBA KK2
Top patents by PatentIndex Score
25 records- 0190US4078228ALoop data highway communication systemOKURA DENKI CO LTD·Filed 1976·Granted Mar 7, 1978·69 cites·10 claims
- 0289US7829935B2Semiconductor memory, semiconductor memory system using the memory, and method for manufacturing quantum dot used in semiconductor memoryUNIV HIROSHIMA·Filed 2008·Granted Nov 9, 2010·19 cites·14 claims
- 0387US7268047B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2006·Granted Sep 11, 2007·12 cites·8 claims
- 0486US7250368B2Semiconductor wafer manufacturing method and waferSHINETSU HANDOTAI KK·Filed 2003·Granted Jul 31, 2007·39 cites·19 claims
- 0584US7768032B2Light-emitting device with enhanced luminous efficiency and method of producing the sameUNIV HIROSHIMA·Filed 2008·Granted Aug 3, 2010·11 cites·11 claims
- 0678US10339602B2Power adjustment system, power adjustment method, and computer programPANASONIC IP MAN CO LTD·Filed 2014·Granted Jul 2, 2019·3 cites·6 claims
- 0778US6346485B1Semiconductor wafer processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 2000·Granted Feb 12, 2002·16 cites·2 claims
- 0875US4121118ABipolar signal generating apparatusOKURA DENKI CO LTD·Filed 1977·Granted Oct 17, 1978·27 cites·4 claims
- 0972US6432837B2Semiconductor wafer processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 2001·Granted Aug 13, 2002·11 cites·6 claims
- 1068US4153848AReceiver circuitOKURA DENKI CO LTD·Filed 1977·Granted May 8, 1979·12 cites·3 claims
- 1165US7898020B2Semiconductor memory, semiconductor memory system using the same, and method for producing quantum dots applied to semiconductor memoryUNIV HIROSHIMA·Filed 2007·Granted Mar 1, 2011·3 cites·11 claims
- 1259US10365677B2Power management system, power management method, and computer programPANASONIC IP MAN CO LTD·Filed 2014·Granted Jul 30, 2019·0 cites·8 claims
- 1359US6239039B1Semiconductor wafers processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 1998·Granted May 29, 2001·17 cites·11 claims
- 1455US7034369B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2004·Granted Apr 25, 2006·5 cites·15 claims
- 1554US8653518B2Semiconductor deviceMAKIHARA KATSUNORI·Filed 2007·Granted Feb 18, 2014·2 cites·20 claims
- 1654US5784373ASwitching device for LANMATSUSHITA ELECTRIC WORKS LTD·Filed 1996·Granted Jul 21, 1998·37 cites·10 claims
- 1752US6844269B2Etching method for semiconductor silicon waferSHINETSU HANDOTAI KK·Filed 2000·Granted Jan 18, 2005·3 cites·1 claims
- 1850US10453154B2Power adjustment system, power adjustment method, and computer programPANASONIC IP MAN CO LTD·Filed 2014·Granted Oct 22, 2019·0 cites·12 claims
- 1949US10461535B2Power management system, power management method, and computer programPANASONIC IP MAN CO LTD·Filed 2014·Granted Oct 29, 2019·0 cites·13 claims
- 2046US7812621B2Measuring apparatus and method for measuring a surface capacitance of an insulating filmUNIV HIROSHIMA·Filed 2008·Granted Oct 12, 2010·0 cites·10 claims
- 2146US4255813ADicode transmission systemOKURA DENKI CO LTD·Filed 1978·Granted Mar 10, 1981·8 cites·9 claims
- 2246US2010140683A1Silicon nitride film and nonvolatile semiconductor memory deviceTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2341US5976983AMethod of cleaning semiconductor wafers after lappingSHINETSU HANDOTAI KK·Filed 1998·Granted Nov 2, 1999·13 cites·19 claims
- 2439US2016196622A1Power adjustment system, power adjustment method, and programPANASONIC IP MAN CO LTD·Filed 2014·Application pending·0 cites
- 2535US2004072437A1Production method for silicon wafer and silicon wafer and soi waferFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →