Inventor · disambiguated record
Seiichi Nakatani
Also filed as: NAKATANI SEIICHI
195 granted patents·28 pending applications·6,053 citations·filing 1976–2014
99Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD126PANASONIC CORP46PANASONIC IP MAN CO LTD11HIRANO KOICHI5KITAE TAKASHI5
Top patents by PatentIndex Score
223 records- 0199US6734542B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 11, 2004·347 cites·34 claims
- 0299US6392525B1Magnetic element and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted May 21, 2002·243 cites·7 claims
- 0398US7365416B2Multi-level semiconductor module and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 29, 2008·144 cites·13 claims
- 0498US7294587B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Nov 13, 2007·64 cites·10 claims
- 0598US6784530B2Circuit component built-in module with embedded semiconductor chip and method of manufacturingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 31, 2004·169 cites·11 claims
- 0698US6538210B2Circuit component built-in module, radio device having the same, and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 25, 2003·211 cites·26 claims
- 0798US6038133ACircuit component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Mar 14, 2000·307 cites·14 claims
- 0897US7748110B2Method for producing connection memberPANASONIC CORP·Filed 2007·Granted Jul 6, 2010·50 cites·8 claims
- 0997US6975516B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 13, 2005·110 cites·26 claims
- 1097US6489685B2Component built-in module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 3, 2002·111 cites·24 claims
- 1197US5888627APrinted circuit board and method for the manufacture of sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Mar 30, 1999·144 cites·31 claims
- 1297US5484647AConnecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jan 16, 1996·212 cites·9 claims
- 1396US7258549B2Connection member and mount assembly and production method of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Aug 21, 2007·61 cites·23 claims
- 1496US7134198B2Method for manufacturing electric element built-in module with sealed electric elementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Nov 14, 2006·113 cites·22 claims
- 1595US7198996B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 3, 2007·31 cites·2 claims
- 1695US7018866B2Circuit component built-in module with embedded semiconductor chip and method of manufacturingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Mar 28, 2006·83 cites·15 claims
- 1795US6871396B2Transfer material for wiring substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 29, 2005·69 cites·22 claims
- 1894US6855892B2Insulation sheet, multi-layer wiring substrate and production processes thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 15, 2005·62 cites·44 claims
- 1994US6798121B2Module with built-in electronic elements and method of manufacture thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 28, 2004·80 cites·15 claims
- 2094US4812422ADielectric paste and method of manufacturing the pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted Mar 14, 1989·79 cites·3 claims
- 2193US7667974B2Module and mounted structure using the samePANASONIC CORP·Filed 2005·Granted Feb 23, 2010·22 cites·6 claims
- 2293US7247178B2Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Jul 24, 2007·20 cites·21 claims
- 2393US6860004B2Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sinkMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 1, 2005·68 cites·3 claims
- 2493US6060150ASheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted May 9, 2000·101 cites·23 claims
- 2592US7400512B2Module incorporating a capacitor, method for manufacturing the same, and capacitor used thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Granted Jul 15, 2008·20 cites·11 claims
- 2692US6939738B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Sep 6, 2005·56 cites·3 claims
- 2792US6625037B2Printed circuit board and method manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 23, 2003·60 cites·23 claims
- 2892US5652042AConductive paste compound for via hole filling, printed circuit board which uses the conductive pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jul 29, 1997·111 cites·15 claims
- 2992US5440075ATwo-sided printed circuit board a multi-layered printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Aug 8, 1995·115 cites·16 claims
- 3091US7773386B2Flexible substrate, multilayer flexible substratePANASONIC CORP·Filed 2007·Granted Aug 10, 2010·13 cites·11 claims
- 3191US7537961B2Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the samePANASONIC CORP·Filed 2007·Granted May 26, 2009·18 cites·9 claims
- 3291US7531387B1Flip chip mounting method and bump forming methodPANASONIC CORP·Filed 2006·Granted May 12, 2009·19 cites·29 claims
- 3391US7394663B2Electronic component built-in module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 1, 2008·50 cites·15 claims
- 3490US8525172B2Flexible semiconductor devicePANASONIC CORP·Filed 2012·Granted Sep 3, 2013·9 cites·8 claims
- 3590US7205483B2Flexible substrate having interlaminar junctions, and process for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 17, 2007·17 cites·20 claims
- 3690US6570099B1Thermal conductive substrate and the method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 27, 2003·53 cites·20 claims
- 3790US6525921B1Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 25, 2003·53 cites·16 claims
- 3890US6338767B1Circuit component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 15, 2002·48 cites·22 claims
- 3990US6096411AConductive paste composition for via hole filling and printed circuit board using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Aug 1, 2000·73 cites·14 claims
- 4090US5183594AConductive resin composition containing zinc oxide whiskers having a tetrapod structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1989·Granted Feb 2, 1993·59 cites·21 claims
- 4189US7714444B2Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the samePANASONIC CORP·Filed 2009·Granted May 11, 2010·9 cites·10 claims
- 4289US7443021B2Electronic component packaging structure and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Oct 28, 2008·15 cites·10 claims
- 4389US7141884B2Module with a built-in semiconductor and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 28, 2006·43 cites·27 claims
- 4489US6958535B2Thermal conductive substrate and semiconductor module using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 25, 2005·45 cites·24 claims
- 4589US6473293B2Capacitor unit, method for producing the same, and solid electrolytic capacitorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 29, 2002·50 cites·9 claims
- 4689US5972482APrinted circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Oct 26, 1999·57 cites·15 claims
- 4788US7799607B2Process for forming bumps and solder bumpPANASONIC CORP·Filed 2005·Granted Sep 21, 2010·16 cites·21 claims
- 4888US7611040B2Method for forming solder bump and method for mounting semiconductor device using a solder powder resin compositionPANASONIC CORP·Filed 2006·Granted Nov 3, 2009·13 cites·12 claims
- 4988US7319599B2Module incorporating a capacitor, method for manufacturing the same, and capacitor used thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jan 15, 2008·33 cites·11 claims
- 5088US7126811B2Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 24, 2006·34 cites·30 claims
Showing the top 50 of 223 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →