Inventor · disambiguated record
Seiichiro Ohashi
Also filed as: OHASHI SEIICHIRO
4 granted patents·1 pending application·12 citations·filing 2008–2015
64Inventor score
Top patents by PatentIndex Score
5 records- 0180US8533942B2Production method of multilayer printed wiring board and multilayer printed wiring boardOHASHI SEIICHIRO·Filed 2008·Granted Sep 17, 2013·12 cites·9 claims
- 0257US9060456B2Production method of multilayer printed wiring board and multilayer printed wiring boardAJINOMOTO KK·Filed 2013·Granted Jun 16, 2015·0 cites·6 claims
- 0349US8337655B2Process for producing multilayer printed wiring boardNAKAMURA SHIGEO·Filed 2010·Granted Dec 25, 2012·0 cites·13 claims
- 0448US8992713B2Process for producing multilayer printed wiring boardNAKAMURA SHIGEO·Filed 2012·Granted Mar 31, 2015·0 cites·18 claims
- 0541US2015368518A1Protective film-laminated adhesive sheetAJINOMOTO KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →