US2015368518A1PendingUtilityA1

Protective film-laminated adhesive sheet

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Assignee: AJINOMOTO KKPriority: Jun 18, 2014Filed: Jun 16, 2015Published: Dec 24, 2015
Est. expiryJun 18, 2034(~7.9 yrs left)· nominal 20-yr term from priority
C09J 2463/00C09J 2467/006H05K 2203/0264C09J 7/35C09J 7/403C09J 2203/326H05K 3/46Y10T428/24355H05K 2203/0191C09J 2423/10H05K 2203/0143C09J 7/22C09J 7/0285H05K 3/04H05K 3/0058C09J 7/0246H05K 3/4673C09J 2301/122
41
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Claims

Abstract

Protective film-laminated adhesive sheets which include; an adhesive sheet including a support having first and second surfaces and a resin composition layer in contact with the second surface of the support; and a protective film having first and second surfaces with the second surface of the protective film in contact with the resin composition layer of the adhesive sheet and in which the first surface of the protective film has an arithmetic mean roughness (Ra p1 ) of 100 nm or more, and the second surface of the protective film has an arithmetic mean roughness (Ra p2 ) of 100 nm or more are capable of suppressing a winding displacement when the sheet is wound into a roll and are capable of preventing a resin separation when the protective film is peeled off in an automatic cutter device.

Claims

exact text as granted — not AI-modified
1 . A protective film-laminated adhesive sheet comprising:
 an adhesive sheet comprising a support having a first surface and a second surface, and a resin composition layer in contact with said second surface of said support; and   a protective film having a first surface and a second surface, wherein said second surface of said protective film is in contact with said resin composition layer of said adhesive sheet,   wherein   said first surface of the protective film has an arithmetic mean roughness (Ra p1 ) of 100 nm or more, wherein said arithmetic mean roughness (Ra p1 ) is measured in conformity with Japanese Industrial Standard (JIS) B 0601, and   said second surface of said protective film has an arithmetic mean roughness (Ra p2 ) of 100 nm or more, wherein said arithmetic mean roughness (Ra p2 ) is measured in conformity with JIS B 0601.   
     
     
         2 . A protective film-laminated adhesive sheet comprising:
 an adhesive sheet comprising a support having a first surface and a second surface, and a resin composition layer in contact with said second surface of said support; and   a protective film having a first surface and a second surface, wherein said second surface of said protective is in contact with the resin composition layer of the adhesive sheet,   wherein   said first surface of said protective film has an arithmetic mean roughness (Ra p1 ) of 100 nm or more, wherein said arithmetic mean roughness (Ra p1 ) is measured using a non-contact type surface roughness meter in a VSI contact mode in a measurement region of 121 μm×92 μm with a 50-power lens, and   said second surface of said protective film has an arithmetic mean roughness (Ra p2 ) of 100 nm or more, wherein said arithmetic mean roughness (Ra p2 ) is measured using a non-contact type surface roughness meter in a VSI contact mode in a measurement region of 121 μm×92 μm with a 50-power lens.   
     
     
         3 . A protective film-laminated adhesive sheet according to  claim 1 , wherein said resin composition layer contains an inorganic filler in an amount of 60% by mass or more when an amount of non-volatile components in the resin composition layer is defined as 100% by mass. 
     
     
         4 . A protective film-laminated adhesive sheet according to  claim 1 , wherein a sum of the arithmetic mean roughness (Ra p1 ) of said first surface of said protective film and an arithmetic mean roughness (Ra s1 ) of said first surface of the support is 120 nm or more. 
     
     
         5 . A protective film-laminated adhesive sheet according to  claim 1 , wherein said protective film has a thickness of 10 to 30 μm. 
     
     
         6 . A protective film-laminated adhesive sheet according to  claim 1 , wherein said support has a thickness of 10 to 50 μm. 
     
     
         7 . A protective film-laminated adhesive sheet according to  claim 1 , wherein said resin composition layer has a thickness of 1 to 25 μm. 
     
     
         8 . A roll-shaped protective film-laminated adhesive sheet, in which a protective film-laminated adhesive sheet according to  claim 1  is wound into a roll. 
     
     
         9 . A method of producing a printed wiring board, comprising:
 (I) forming a stacked body using a roll-shaped protective film-laminated adhesive sheet according to  claim 8 , said stacked body comprising a cut piece of the adhesive sheet disposed on a surface of an internal layer substrate;   (II) heating and pressing said stacked body to laminate said adhesive sheet onto said internal layer substrate; and   (III) thermally curing said resin composition layer of said adhesive sheet to form an insulating layer.   
     
     
         10 . A method according to  claim 9 , wherein step (I) comprises:
 (a-1) peeling off said protective film while said protective film-laminated adhesive sheet is conveyed from said roll-shaped protective film-laminated adhesive sheet;   (a-2) disposing, onto said internal layer substrate, said adhesive sheet in which said resin composition layer is exposed, so that said resin composition layer is in contact with said internal layer substrate;   (a-3) heating and pressing a part of said adhesive sheet, from said support side, to partially bond said adhesive sheet to said internal layer substrate; and   (a-4) cutting said adhesive sheet with a cutter according to a size of said internal layer substrate, so that the cut piece of said adhesive sheet is disposed on the surface of said internal layer substrate.   
     
     
         11 . A protective film-laminated adhesive sheet according to  claim 2 , wherein said resin composition layer contains an inorganic filler in an amount of 60% by mass or more when an amount of non-volatile components in the resin composition layer is defined as 100% by mass. 
     
     
         12 . A protective film-laminated adhesive sheet according to  claim 2 , wherein a sum of the arithmetic mean roughness (Ra p1 ) of said first surface of said protective film and an arithmetic mean roughness (Ra s1 ) of said first surface of the support is 120 nm or more. 
     
     
         13 . A protective film-laminated adhesive sheet according to  claim 2 , wherein said protective film has a thickness of 10 to 30 μm. 
     
     
         14 . A protective film-laminated adhesive sheet according to  claim 2 , wherein said support has a thickness of 10 to 50 μm. 
     
     
         15 . A protective film-laminated adhesive sheet according to  claim 2 , wherein said resin composition layer has a thickness of 1 to 25 μm. 
     
     
         16 . A roll-shaped protective film-laminated adhesive sheet, in which a protective film-laminated adhesive sheet according to  claim 2  is wound into a roll. 
     
     
         17 . A method of producing a printed wiring board, comprising:
 (I) forming a stacked body using a roll-shaped protective film-laminated adhesive sheet according to  claim 16 , said stacked body comprising a cut piece of the adhesive sheet disposed on a surface of an internal layer substrate;   (II) heating and pressing said stacked body to laminate said adhesive sheet onto said internal layer substrate; and   (III) thermally curing said resin composition layer of said adhesive sheet to form an insulating layer.   
     
     
         18 . A method according to  claim 17 , wherein step (I) comprises:
 (a-1) peeling off said protective film while said protective film-laminated adhesive sheet is conveyed from said roll-shaped protective film-laminated adhesive sheet;   (a-2) disposing, onto said internal layer substrate, said adhesive sheet in which said resin composition layer is exposed, so that said resin composition layer is in contact with said internal layer substrate;   (a-3) heating and pressing a part of said adhesive sheet, from said support side, to partially bond said adhesive sheet to said internal layer substrate; and   (a-4) cutting said adhesive sheet with a cutter according to a size of said internal layer substrate, so that the cut piece of said adhesive sheet is disposed on the surface of said internal layer substrate.

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