Inventor · disambiguated record
Seongchan Park
Also filed as: PARK SEONGCHAN
8 granted patents·7 pending applications·21 citations·filing 2006–2024
80Inventor score
Top patents by PatentIndex Score
15 records- 0191US12136610B2Unit pixel and displaying apparatus including the unit pixelSEOUL VIOSYS CO LTD·Filed 2021·Granted Nov 5, 2024·2 cites·20 claims
- 0287US8168104B2In-line process for preparing wood plastic composite panel with the appearance and texture similar to natural lumbers and apparatus thereforHAN YOUSOO·Filed 2006·Granted May 1, 2012·10 cites·8 claims
- 0381US12083489B2LED mixer using vibratory bowl feederSEOUL VIOSYS CO LTD·Filed 2021·Granted Sep 10, 2024·1 cites·18 claims
- 0479US9061941B2Functional inorganic board and manufacturing method thereofKANG GILHO·Filed 2010·Granted Jun 23, 2015·7 cites·16 claims
- 0573US2025022856A1Unit pixel and displaying apparatus including the unit pixelSEOUL VIOSYS CO LTD·Filed 2024·Application pending·0 cites
- 0670US2024243242A1Unit pixel having light emitting device displaying apparatusSEOUL VIOSYS CO LTD·Filed 2024·Application pending·0 cites
- 0765US12439758B2Wafer having auxiliary pattern for aligning light emitting device and method of fabricating unit pixel using the sameSEOUL VIOSYS CO LTD·Filed 2021·Granted Oct 7, 2025·0 cites·19 claims
- 0863US11901269B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 0962US11949055B2Unit pixel having light emitting device and displaying apparatusSEOUL VIOSYS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·19 claims
- 1054US8697221B2Plastic composite panel with the appearance and texture similar to natural lumbersHAN YOUSOO·Filed 2006·Granted Apr 15, 2014·1 cites·7 claims
- 1153US2023154895A1Pixel device for led display and led display apparatus having the sameSEOUL VIOSYS CO LTD·Filed 2022·Application pending·0 cites
- 1249US2022199857A1Unit pixel and displaying apparatus including the unit pixelSEOUL VIOSYS CO LTD·Filed 2021·Application pending·0 cites
- 1348US2020211938A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1446US2010137513A1Process for Preparation of Composite Containing Wood Fiber Component and Polymer ResinHAN YOUSOO·Filed 2006·Application pending·0 cites
- 1542US2007023973A1Process for extruding solid state polymer using ultrasound and device thereforHAN YOUSOO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →