Inventor · disambiguated record
Seyang Park
Also filed as: PARK SEYANG
4 granted patents·138 citations·filing 2004–2008
80Inventor score
Top patents by PatentIndex Score
4 records- 0193US8308931B2Method and apparatus for electroplatingREID JONATHAN·Filed 2008·Granted Nov 13, 2012·62 cites·34 claims
- 0292US7405157B1Methods for the electrochemical deposition of copper onto a barrier layer of a work pieceNOVELLUS SYSTEMS INC·Filed 2005·Granted Jul 29, 2008·29 cites·15 claims
- 0390US7799684B1Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafersNOVELLUS SYSTEMS INC·Filed 2007·Granted Sep 21, 2010·22 cites·40 claims
- 0476US7442267B1Anneal of ruthenium seed layer to improve copper platingNOVELLUS SYSTEMS INC·Filed 2004·Granted Oct 28, 2008·25 cites·43 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →