Inventor · disambiguated record
Seungdae Seok
Also filed as: SEOK SEUNGDAE
3 granted patents·6 pending applications·3 citations·filing 2017–2025
53Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0181US12027401B2Semiconductor substrate alignment device and a semiconductor substrate bonding system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 2, 2024·2 cites·20 claims
- 0267US11443965B2Wafer to wafer bonding apparatusesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·1 cites·20 claims
- 0360US2025266397A1Semiconductor package including multiple chip structuresSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0446US2024234215A9Apparatus for measuring an adhesion forceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0546US2025391721A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0646US2024153906A1Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0745US2024038536A1Plasma processing apparatus, wafer to wafer bonding system and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0836US2021143030A1Wafer to wafer bonding apparatus, wafer to wafer bonding system, and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 0931US10784130B2Bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 22, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →