Inventor · disambiguated record
Seung-Hun Shin
Also filed as: SHIN SEUNG-HUN
27 granted patents·4 pending applications·119 citations·filing 2007–2024
95Inventor score
Top patents by PatentIndex Score
31 records- 0196US9048354B2Methods of forming a through via structurePARK BYUNG-JUN·Filed 2013·Granted Jun 2, 2015·30 cites·30 claims
- 0294US9608026B2Through via structure, methods of forming the samePARK BYUNG-JUN·Filed 2015·Granted Mar 28, 2017·12 cites·18 claims
- 0393US9443892B2Image sensor and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 13, 2016·11 cites·13 claims
- 0491US10672823B2Image sensorsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 2, 2020·8 cites·15 claims
- 0589US9165974B2Electronic devices including multiple semiconductor layersSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 20, 2015·12 cites·20 claims
- 0686US8415189B2Methods of fabricating image sensors including impurity layer isolation regionsKWON DOOWON·Filed 2009·Granted Apr 9, 2013·13 cites·21 claims
- 0783US9728572B2Via structures including etch-delay structures and semiconductor devices having via plugsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 8, 2017·5 cites·15 claims
- 0883US7586170B2Image sensors including impurity layer adjacent isolation regionSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 8, 2009·6 cites·16 claims
- 0981US10971537B2Image sensorsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 6, 2021·1 cites·20 claims
- 1080US10477082B2Camera assembly and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·4 cites·20 claims
- 1179US10229949B2Via structures including etch-delay structures and semiconductor devices having via plugsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 12, 2019·2 cites·20 claims
- 1279US9455284B2Stack type image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 27, 2016·3 cites·20 claims
- 1376US7998782B2Fabrication of image sensor with improved signal to noise ratioSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 16, 2011·3 cites·20 claims
- 1473US2024379626A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1571US10867857B2Method of cutting substrate and method of singulating semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·14 claims
- 1668US9825081B2Semiconductor devices having a pad structureSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 21, 2017·2 cites·19 claims
- 1768US7884400B2Image device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 8, 2011·1 cites·15 claims
- 1866US12074141B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·13 claims
- 1964US8916911B2Semiconductor devices having backside illuminated image sensorsYOO GIL-SANG·Filed 2011·Granted Dec 23, 2014·2 cites·20 claims
- 2063US8043927B2Method of manufacturing a CMOS image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 25, 2011·2 cites·13 claims
- 2159US10943939B2Via structures including etch-delay structures and semiconductor devices having via plugsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 9, 2021·0 cites·20 claims
- 2258US10265038B2X-ray photographing device comprising variable type armVATECH CO LTD·Filed 2015·Granted Apr 23, 2019·1 cites·14 claims
- 2352US11871864B2Compression type ramen cooker using induction heaterSHIN SEUNG HUN·Filed 2020·Granted Jan 16, 2024·0 cites·5 claims
- 2451US11819154B2Compression chamber for compression type ramen cookerSHIN SEUNG HUN·Filed 2020·Granted Nov 21, 2023·0 cites·5 claims
- 2551US11224114B2X-ray generatorVATECH CO LTD·Filed 2020·Granted Jan 11, 2022·0 cites·6 claims
- 2650US2008150057A1Image sensor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2749US11558012B2Oscillator and method of driving the sameLX SEMICON CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·14 claims
- 2847US12513807B2X-ray source driving circuit, and X-ray generation device using sameVATECH CO LTD·Filed 2021·Granted Dec 30, 2025·0 cites·15 claims
- 2947US2016365374A1Stack type image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 3039US2012313208A1Image sensor and method of forming the sameKIM SANG-HOON·Filed 2012·Application pending·0 cites
- 3135US11040651B2Multifunctional switch device for vehiclesLS AUTOMOTIVE TECH CO LTD·Filed 2017·Granted Jun 22, 2021·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →