Inventor · disambiguated record
Seiji Take
Also filed as: TAKE SEIJI
24 granted patents·12 pending applications·428 citations·filing 1986–2024
96Inventor score
Files withDAINIPPON PRINTING CO LTD29UENO SHIGEHIRO3TAKE SEIJI2DAI NIPPON INSATSU KABUSHIKA K1OKADA MASATO1
Top patents by PatentIndex Score
36 records- 0196US5731116AElectrostatic information recording medium and electrostatic information recording and reproducing methodDAINIPPON PRINTING CO LTD·Filed 1995·Granted Mar 24, 1998·112 cites·37 claims
- 0293US7259320B2Thermoelectric conversion materialsDAINIPPON PRINTING CO LTD·Filed 2005·Granted Aug 21, 2007·30 cites·4 claims
- 0387US5718996AElectrostatic information recording medium and electrostatic information recording and reproducing methodDAINIPPON PRINTING CO LTD·Filed 1996·Granted Feb 17, 1998·39 cites·19 claims
- 0487US5587264AElectrostatic information recording medium and electrostatic information recording and reproducing methodDAINIPPON PRINTING CO LTD·Filed 1995·Granted Dec 24, 1996·40 cites·14 claims
- 0583US5439768AElectrostatic information recording medium and electrostatic information recording and reproducing methodDAINIPPON PRINTING CO LTD·Filed 1990·Granted Aug 8, 1995·29 cites·23 claims
- 0683US4841134AIC cardDAI NIPPON INSATSU KABUSHIKA K·Filed 1986·Granted Jun 20, 1989·74 cites·22 claims
- 0783US2024421471A1Wiring board and method for manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 0882US12424752B2Wiring board and method for manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2021·Granted Sep 23, 2025·1 cites·18 claims
- 0982US11705624B2Wiring board and method for manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2018·Granted Jul 18, 2023·2 cites·25 claims
- 1082US9102872B2Device material for hole injection transport layer, ink for forming hole injection transport layer, device comprising hole injection transport layer, and method for producing the deviceUENO SHIGEHIRO·Filed 2010·Granted Aug 11, 2015·6 cites·20 claims
- 1181US2025016928A1Wiring board and method for manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 1280US12107327B2Wiring board and method for manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·8 claims
- 1374US7255922B2Inorganic nanoparticle and method for producing the sameDAINIPPON PRINTING CO LTD·Filed 2005·Granted Aug 14, 2007·3 cites·8 claims
- 1471US12156337B2Wiring board and method for manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2021·Granted Nov 26, 2024·0 cites·18 claims
- 1567US5683838AMethod of producing information recording mediumDAINIPPON PRINTING CO LTD·Filed 1995·Granted Nov 4, 1997·15 cites·2 claims
- 1666US5514504AInformation recording medium, and information recording a reproducing methodDAINIPPON PRINTING CO LTD·Filed 1993·Granted May 7, 1996·22 cites·27 claims
- 1765US8778233B2Device comprising positive hole injection transport layer, method for producing the same and ink for forming positive hole injection transport layerUENO SHIGEHIRO·Filed 2012·Granted Jul 15, 2014·1 cites·6 claims
- 1865US4981746AHeat-sensitive stencil sheetDAINIPPON PRINTING CO LTD·Filed 1988·Granted Jan 1, 1991·20 cites·23 claims
- 1963US8785921B2Device comprising positive hole injection transport layer, method for producing the same and ink for forming positive hole injection transport layerUENO SHIGEHIRO·Filed 2009·Granted Jul 22, 2014·1 cites·19 claims
- 2061US11916285B2Wiring board and method for manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2019·Granted Feb 27, 2024·0 cites·12 claims
- 2160US2009007726A1InSb NANOPARTICLETAKE SEIJI·Filed 2008·Application pending·0 cites
- 2259US5981123AElectrostatic information recording medium and electrostatic information recording and reproducing methodDAINIPPON PRINTING CO LTD·Filed 1997·Granted Nov 9, 1999·19 cites·18 claims
- 2354US2006094860A1InSb nanoparticleTAKE SEIJI·Filed 2005·Application pending·0 cites
- 2452US2025194361A1Wiring board, module, and image display deviceDAINIPPON PRINTING CO LTD·Filed 2023·Application pending·0 cites
- 2551US2024258690A1Wiring board, module, and image display apparatusDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 2649US9155159B2Light emitting device having quantum cut dots with a protecting material and prolonged drive lifetime and good color purityOKADA MASATO·Filed 2008·Granted Oct 6, 2015·0 cites·6 claims
- 2745US5571646AElectrostatic information-recording media and process for recording and reproducing electrostatic informationDAINIPPON PRINTING CO LTD·Filed 1995·Granted Nov 5, 1996·5 cites·4 claims
- 2843US5660958AInformation recording medium, and information recording and reproducing methodDAINIPPON PRINTING CO LTD·Filed 1995·Granted Aug 26, 1997·4 cites·30 claims
- 2943US5492783AElectrostatic information-recording media and process for recording and reproducing electrostatic informationDAINIPPON PRINTING CO LTD·Filed 1993·Granted Feb 20, 1996·4 cites·4 claims
- 3043US2025016927A1Module, image display device laminate, image display device, manufacturing method of module, and wiring boardDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3142US2025013089A1Image display device laminate, image display device, and moduleDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3242US2024235004A1Wiring board, method for manufacturing wiring board, laminate for image display device, and image display deviceDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3341US2023318203A1Wiring board and method of manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2021·Application pending·0 cites
- 3441US2024121999A1Multilayer body for image display device and image display deviceDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3540US2024188227A1Wiring board and method of manufacturing wiring boardDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3632US6013603AImage-receiving sheetDAINIPPON PRINTING CO LTD·Filed 1998·Granted Jan 11, 2000·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →