Inventor · disambiguated record
Senh Thach
Also filed as: THACH SENH
34 granted patents·12 pending applications·1,071 citations·filing 1998–2018
98Inventor score
Top patents by PatentIndex Score
46 records- 0198US10460916B2Real time monitoring with closed loop chucking force controlAPPLIED MATERIALS INC·Filed 2018·Granted Oct 29, 2019·45 cites·11 claims
- 0298US8367227B2Plasma-resistant ceramics with controlled electrical resistivityAPPLIED MATERIALS INC·Filed 2007·Granted Feb 5, 2013·71 cites·8 claims
- 0398US8206829B2Plasma resistant coatings for plasma chamber componentsSUN JENNIFER Y·Filed 2008·Granted Jun 26, 2012·83 cites·24 claims
- 0497US8941969B2Single-body electrostatic chuckAPPLIED MATERIALS INC·Filed 2012·Granted Jan 27, 2015·44 cites·20 claims
- 0597US8758858B2Method of producing a plasma-resistant thermal oxide coatingSUN JENNIFER Y·Filed 2012·Granted Jun 24, 2014·38 cites·9 claims
- 0697US8129029B2Erosion-resistant plasma chamber components comprising a metal base structure with an overlying thermal oxidation coatingSUN JENNIFER Y·Filed 2007·Granted Mar 6, 2012·39 cites·10 claims
- 0797US7220937B2Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contaminationAPPLIED MATERIALS INC·Filed 2004·Granted May 22, 2007·94 cites·54 claims
- 0896US8871312B2Method of reducing plasma arcing on surfaces of semiconductor processing apparatus components in a plasma processing chamberSUN JENNIFER Y·Filed 2012·Granted Oct 28, 2014·21 cites·5 claims
- 0996US6776873B1Yttrium oxide based surface coating for semiconductor IC processing vacuum chambersFiled 2002·Granted Aug 17, 2004·153 cites·6 claims
- 1095US7479464B2Low temperature aerosol deposition of a plasma resistive layerAPPLIED MATERIALS INC·Filed 2006·Granted Jan 20, 2009·45 cites·21 claims
- 1193US7479304B2Gas distribution plate fabricated from a solid yttrium oxide-comprising substrateAPPLIED MATERIALS INC·Filed 2004·Granted Jan 20, 2009·42 cites·16 claims
- 1293US6949203B2System level in-situ integrated dielectric etch process particularly useful for copper dual damasceneAPPLIED MATERIALS INC·Filed 2003·Granted Sep 27, 2005·69 cites·46 claims
- 1386US6659331B2Plasma-resistant, welded aluminum structures for use in semiconductor apparatusAPPLIED MATERIALS INC·Filed 2002·Granted Dec 9, 2003·30 cites·36 claims
- 1485US8067067B2Clean, dense yttrium oxide coating protecting semiconductor processing apparatusSUN JENNIFER Y·Filed 2004·Granted Nov 29, 2011·26 cites·9 claims
- 1585US6795292B2Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamberFiled 2001·Granted Sep 21, 2004·41 cites·26 claims
- 1685US6151203AConnectors for an electrostatic chuck and combination thereofAPPLIED MATERIALS INC·Filed 1998·Granted Nov 21, 2000·76 cites·20 claims
- 1783US7048814B2Halogen-resistant, anodized aluminum for use in semiconductor processing apparatusAPPLIED MATERIALS INC·Filed 2002·Granted May 23, 2006·16 cites·4 claims
- 1882US9558981B2Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methodsAPPLIED MATERIALS INC·Filed 2014·Granted Jan 31, 2017·4 cites·15 claims
- 1980US11264261B2High temperature electrostatic chuck bonding adhesiveAPPLIED MATERIALS INC·Filed 2016·Granted Mar 1, 2022·2 cites·22 claims
- 2079US9622375B2Electrostatic chuck with external flow adjustments for improved temperature distributionBUSCHE MATTHEW J·Filed 2013·Granted Apr 11, 2017·5 cites·13 claims
- 2178US9520314B2High temperature electrostatic chuck bonding adhesiveSUN JENNIFER Y·Filed 2009·Granted Dec 13, 2016·4 cites·23 claims
- 2277US6466426B1Method and apparatus for thermal control of a semiconductor substrateAPPLIED MATERIALS INC·Filed 1999·Granted Oct 15, 2002·57 cites·27 claims
- 2376US10403534B2Pixilated cooling, temperature controlled substrate support assemblyAPPLIED MATERIALS INC·Filed 2014·Granted Sep 3, 2019·3 cites·20 claims
- 2476US9520315B2Electrostatic chuck with internal flow adjustments for improved temperature distributionPARKHE VIJAY D·Filed 2013·Granted Dec 13, 2016·3 cites·20 claims
- 2576US6572814B2Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gasAPPLIED MATERIALS INC·Filed 2001·Granted Jun 3, 2003·21 cites·15 claims
- 2674US9916998B2Substrate support assembly having a plasma resistant protective layerAPPLIED MATERIALS INC·Filed 2013·Granted Mar 13, 2018·2 cites·11 claims
- 2772US10557202B2Method of processing a substrate support assemblyAPPLIED MATERIALS INC·Filed 2017·Granted Feb 11, 2020·1 cites·17 claims
- 2872US10121688B2Electrostatic chuck with external flow adjustments for improved temperature distributionAPPLIED MATERIALS INC·Filed 2017·Granted Nov 6, 2018·1 cites·20 claims
- 2970US7718029B2Self-passivating plasma resistant material for joining chamber componentsAPPLIED MATERIALS INC·Filed 2006·Granted May 18, 2010·6 cites·10 claims
- 3067US6736668B1High temperature electrical connectorFiled 2000·Granted May 18, 2004·16 cites·22 claims
- 3167US2009087615A1Corrosion-resistant gas distribution plate for plasma processing chamberSUN JENNIFER Y·Filed 2008·Application pending·0 cites
- 3262US8231736B2Wet clean process for recovery of anodized chamber partsSUN JENNIFER Y·Filed 2007·Granted Jul 31, 2012·1 cites·16 claims
- 3362US7033447B2Halogen-resistant, anodized aluminum for use in semiconductor processing apparatusAPPLIED MATERIALS INC·Filed 2002·Granted Apr 25, 2006·8 cites·2 claims
- 3458US2010140222A1Filled polymer composition for etch chamber componentSUN JENNIFER Y·Filed 2009·Application pending·0 cites
- 3556US2009214825A1Ceramic coating comprising yttrium which is resistant to a reducing plasmaAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 3655US9875923B2Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methodsAPPLIED MATERIALS INC·Filed 2016·Granted Jan 23, 2018·0 cites·19 claims
- 3754US7055732B2Semiconductor processing apparatus including plasma-resistant, welded aluminum structuresAPPLIED MATERIALS INC·Filed 2003·Granted Jun 6, 2006·4 cites·23 claims
- 3854US2008213496A1Method of coating semiconductor processing apparatus with protective yttrium-containing coatingsAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 3952US2018151401A1Substrate support assembly having a plasma resistant protective layerAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 4052US2004224171A1Electrochemically roughened aluminum semiconductor chamber surfacesFiled 2004·Application pending·0 cites
- 4146US2003047464A1Electrochemically roughened aluminum semiconductor processing apparatus surfacesAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 4239US2005016684A1Process kit for erosion resistance enhancementAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4339US2004081439A1Actively-controlled electrostatic chuck heaterAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4437US2003192646A1Plasma processing chamber having magnetic assembly and methodAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 4537US2011198034A1Gas distribution showerhead with coating material for semiconductor processingSUN JENNIFER·Filed 2011·Application pending·0 cites
- 4629US2002022403A1Connectors for an eletrostatic chuckFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →