Inventor · disambiguated record
Seiji Tokii
Also filed as: TOKII SEIJI
4 granted patents·3 pending applications·13 citations·filing 2008–2015
68Inventor score
Top patents by PatentIndex Score
7 records- 0184US9331047B2Mounting method and mounting structure for semiconductor package componentOHASHI NAOMICHI·Filed 2013·Granted May 3, 2016·9 cites·3 claims
- 0248US8233288B2Electronic component package, electronic component mounted apparatus, method of inspecting bonding portion therein, and circuit boardTOKII SEIJI·Filed 2008·Granted Jul 31, 2012·1 cites·15 claims
- 0341US2009227136A1Mounting structure for surface mounted device and method of firmly mounting surface mounted devicePANASONIC CORP·Filed 2009·Application pending·0 cites
- 0441US2011108997A1Mounting method and mounting structure for semiconductor package componentPANASONIC CORP·Filed 2010·Application pending·0 cites
- 0539US8218333B2Printed circuit board and mounting structure for surface mounted deviceUDAKA MASATO·Filed 2009·Granted Jul 10, 2012·3 cites·12 claims
- 0637US2010101845A1Electronic Device and Manufacturing Method for Electronic DeviceKISHI ARATA·Filed 2009·Application pending·0 cites
- 0733US9955604B2Mounting structure and method for supplying reinforcing resin materialPANASONIC IP MAN CO LTD·Filed 2015·Granted Apr 24, 2018·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Seiji Tokii files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →