Inventor · disambiguated record
Seung Taek Yang
Also filed as: YANG SEUNG TAEK
30 granted patents·8 pending applications·193 citations·filing 2006–2017
96Inventor score
Top patents by PatentIndex Score
38 records- 0195US7795139B2Method for manufacturing semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 14, 2010·47 cites·18 claims
- 0294US7429792B2Stack package with vertically formed heat sinkHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 30, 2008·32 cites·12 claims
- 0392US9793217B2Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technologySK HYNIX INC·Filed 2015·Granted Oct 17, 2017·8 cites·13 claims
- 0491US7859115B2Semiconductor package for improving characteristics for transmitting signals and powerHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Dec 28, 2010·21 cites·11 claims
- 0590US8018043B2Semiconductor package having side walls and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 13, 2011·13 cites·9 claims
- 0686US8178975B2Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layersYANG SEUNG TAEK·Filed 2010·Granted May 15, 2012·9 cites·9 claims
- 0785US8383447B2Reverse image sensor module and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2012·Granted Feb 26, 2013·3 cites·8 claims
- 0880US8159066B2Semiconductor package having a heat dissipation memberYANG SEUNG TAEK·Filed 2009·Granted Apr 17, 2012·9 cites·17 claims
- 0979US8154098B2Reverse image sensor module and method for manufacturing the sameYANG SEUNG TAEK·Filed 2009·Granted Apr 10, 2012·4 cites·11 claims
- 1078US7728419B2Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Jun 1, 2010·13 cites·12 claims
- 1175US9716017B2Semiconductor packages including interposer and methods of manufacturing the sameSK HYNIX INC·Filed 2015·Granted Jul 25, 2017·2 cites·11 claims
- 1274US9257413B2Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the sameSK HYNIX INC·Filed 2014·Granted Feb 9, 2016·4 cites·17 claims
- 1373US8357959B2Image sensor module and method of manufacturing the sameSK HYNIX INC·Filed 2008·Granted Jan 22, 2013·2 cites·15 claims
- 1472US8847377B2Stacked wafer level package having a reduced sizeKIM JONG HOON·Filed 2012·Granted Sep 30, 2014·3 cites·11 claims
- 1570US8395245B2Semiconductor package moduleKIM JONG HOON·Filed 2007·Granted Mar 12, 2013·4 cites·18 claims
- 1669US8049341B2Semiconductor package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Nov 1, 2011·3 cites·4 claims
- 1769US7847419B2Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layersHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Dec 7, 2010·4 cites·12 claims
- 1868US9166095B2Image sensor module and method of manufacturing the sameSK HYNIX INC·Filed 2012·Granted Oct 20, 2015·0 cites·10 claims
- 1966US7652347B2Semiconductor package having embedded passive elements and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Jan 26, 2010·2 cites·20 claims
- 2066US7629682B2Wafer level package configured to compensate size difference in different types of packagesHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Dec 8, 2009·3 cites·7 claims
- 2166US7498199B2Method for fabricating semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Mar 3, 2009·3 cites·20 claims
- 2264US9171813B2Substrate including a dam for semiconductor package, semiconductor package using the same, and manufacturing method thereofSK HYNIX INC·Filed 2013·Granted Oct 27, 2015·1 cites·18 claims
- 2361US7884465B2Semiconductor package with passive elements embedded within a semiconductor chipHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Feb 8, 2011·2 cites·16 claims
- 2460US8502366B2Semiconductor packageYANG SEUNG TAEK·Filed 2011·Granted Aug 6, 2013·1 cites·11 claims
- 2553US2011032400A1Image sensor module and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 2652US10090252B2Package-on-package type semiconductor device including fan-out memory packageSK HYNIX INC·Filed 2017·Granted Oct 2, 2018·0 cites·11 claims
- 2752US2009166836A1Stacked wafer level package having a reduced sizeKIM JONG HOON·Filed 2008·Application pending·0 cites
- 2851US2012299199A1Stacked wafer level package having a reduced sizeKIM JONG HOON·Filed 2012·Application pending·0 cites
- 2950US8361838B2Semiconductor package and method for manufacturing the same via holes in semiconductor chip for plurality stack chipsHYNIX SEMICONDUCTOR INC·Filed 2011·Granted Jan 29, 2013·0 cites·11 claims
- 3050US2013309786A1Method for manufacturing image sensor moduleSK HYNIX INC·Filed 2013·Application pending·0 cites
- 3149US2011233795A1Stacked wafer level package having a reduced sizeHYNIX SEMICONDUCTOR INC·Filed 2011·Application pending·0 cites
- 3248US9418875B2Substrate including a dam for semiconductor package, semiconductor package using the same, and manufacturing method thereofSK HYNIX INC·Filed 2015·Granted Aug 16, 2016·0 cites·4 claims
- 3348US2011287584A1Semiconductor package having side walls and method for manufacturing the sameSUH MIN SUK·Filed 2011·Application pending·0 cites
- 3448US2017287734A1Semiconductor packages including interposer and methods of manufacturing the sameSK HYNIX INC·Filed 2017·Application pending·0 cites
- 3547US8217434B2Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the sameSON HO YOUNG·Filed 2009·Granted Jul 10, 2012·0 cites·8 claims
- 3645US7834437B2Semiconductor package with passive elementsHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Nov 16, 2010·0 cites·14 claims
- 3738US8222083B2Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the sameLEE SEUNG HYUN·Filed 2010·Granted Jul 17, 2012·0 cites·9 claims
- 3838US2011309358A1Semiconductor chip with fine pitch leads for normal testing of sameKIM JONG HOON·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →