Inventor · disambiguated record
Seung Uk Yoon
Also filed as: YOON SEUNG U · YOON SEUNG UK
30 granted patents·16 pending applications·708 citations·filing 2003–2024
97Inventor score
Files withELECTRONICS & TELECOMMUNICATIONS RES INST15STATS CHIPPAC LTD9KOREA ELECTRONICS TELECOMM6AGENCY SCIENCE TECH & RES4JCET SEMICONDUCTOR SHAOXING CO LTD3
Top patents by PatentIndex Score
46 records- 0199US8518746B2Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor diePAGAILA REZA A·Filed 2010·Granted Aug 27, 2013·98 cites·20 claims
- 0299US8354297B2Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor dieSTATS CHIPPAC LTD·Filed 2010·Granted Jan 15, 2013·125 cites·25 claims
- 0398US9893045B2Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectSTATS CHIPPAC LTD·Filed 2015·Granted Feb 13, 2018·33 cites·19 claims
- 0497US8896109B2Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor dieSTATS CHIPPAC LTD·Filed 2012·Granted Nov 25, 2014·39 cites·24 claims
- 0597US8822281B2Semiconductor device and method of forming TMV and TSV in WLCSP using same carrierPAGAILA REZA A·Filed 2010·Granted Sep 2, 2014·32 cites·25 claims
- 0696US10791263B1Camera auxiliary device for privacy protection and privacy protection method using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2020·Granted Sep 29, 2020·7 cites·10 claims
- 0796US8682107B2Apparatus and method for creating 3D content for oriental paintingYOON SEUNG-UK·Filed 2011·Granted Mar 25, 2014·183 cites·10 claims
- 0896US8383457B2Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectSTATS CHIPPAC LTD·Filed 2010·Granted Feb 26, 2013·22 cites·20 claims
- 0996US7786008B2Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 31, 2010·45 cites·20 claims
- 1093US9240380B2Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectSTATS CHIPPAC LTD·Filed 2012·Granted Jan 19, 2016·11 cites·27 claims
- 1191US7888184B2Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Feb 15, 2011·17 cites·10 claims
- 1290US9846804B2Apparatus and method for creating three-dimensional personalized figureELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2015·Granted Dec 19, 2017·8 cites·9 claims
- 1389US8957530B2Integrated circuit packaging system with embedded circuitry and postSHIM IL KWON·Filed 2011·Granted Feb 17, 2015·9 cites·10 claims
- 1487US10360313B2Apparatus and method for generating 3D printing model using multiple texturesELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2017·Granted Jul 23, 2019·3 cites·6 claims
- 1587US9484279B2Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor diePAGAILA REZA A·Filed 2010·Granted Nov 1, 2016·8 cites·5 claims
- 1687US7230318B2RF and MMIC stackable micro-modulesAGENCY SCIENCE TECH & RES·Filed 2003·Granted Jun 12, 2007·48 cites·13 claims
- 1779US11232632B2Learning-based 3D model creation apparatus and methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2020·Granted Jan 25, 2022·1 cites·13 claims
- 1877US10643952B2Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor dieJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2016·Granted May 5, 2020·2 cites·25 claims
- 1976US9754858B2Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor dieSTATS CHIPPAC LTD·Filed 2013·Granted Sep 5, 2017·3 cites·1 claims
- 2076US8922547B23D model shape transformation method and apparatusLIM SEONG-JAE·Filed 2011·Granted Dec 30, 2014·5 cites·9 claims
- 2175USRE48111ESemiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jul 21, 2020·2 cites·20 claims
- 2273USRE48408ESemiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jan 26, 2021·1 cites·27 claims
- 2371US12033276B2Learning-based 3D model creation apparatus and methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Jul 9, 2024·0 cites·9 claims
- 2465US9189857B2Apparatus and method for reconstructing three dimensional faces based on multiple camerasKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Nov 17, 2015·2 cites·15 claims
- 2564US2025209701A1Multi-style transformation apparatus and methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 2664US2025182367A1Apparatus and method for realistic movement of digital human characterELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 2763US7592703B2RF and MMIC stackable micro-modulesAGENCY SCIENCE TECH & RES·Filed 2007·Granted Sep 22, 2009·2 cites·19 claims
- 2862US2024028504A1Method and device for evaluating quality of digital humanELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 2959US9245380B2Local multi-resolution 3-D face-inherent model generation apparatus and method and facial skin management systemKIM KAP KEE·Filed 2012·Granted Jan 26, 2016·1 cites·13 claims
- 3058US11138785B2Method and system for generating 3D image of characterELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Granted Oct 5, 2021·0 cites·16 claims
- 3158US2024193824A1Computing device and method for realistic visualization of digital humanELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 3257US2024193845A1Rendering method and device for improving realism of rendered imageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 3356US8902305B2System and method for managing face dataHWANG BON WOO·Filed 2012·Granted Dec 2, 2014·1 cites·20 claims
- 3449US11375107B2Apparatus and method for guiding multi-view captureELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2020·Granted Jun 28, 2022·0 cites·8 claims
- 3549US2010327406A1Semiconductor Device and Method of Forming Inductor Over Insulating Material Filled Trench In SubstrateSTATS CHIPPAC LTD·Filed 2009·Application pending·0 cites
- 3648US2021158606A1Apparatus and method for generating three-dimensional modelELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2020·Application pending·0 cites
- 3745US2020151963A1Training data set generation apparatus and method for machine learningELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Application pending·0 cites
- 3844US2015172637A1Apparatus and method for generating three-dimensional output dataKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 3942US10043278B2Method and apparatus for reconstructing 3D face with stereo cameraELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2015·Granted Aug 7, 2018·0 cites·12 claims
- 4042US2014168216A13d avatar output device and methodKOREA ELECTRONICS TELECOMM·Filed 2013·Application pending·0 cites
- 4142US2014192045A1Method and apparatus for generating three-dimensional caricature using shape and texture of faceKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 4242US2014204089A1Method and apparatus for creating three-dimensional montageKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 4341US2006223313A1Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the sameAGENCY SCIENCE TECH & RES·Filed 2006·Application pending·0 cites
- 4437US2010170086A1Device, unit, system and method for the magnetically-assisted assembling of chip-scale, and nano and micro-scale components onto a substrateAGENCY SCIENCE TECH & RES·Filed 2006·Application pending·0 cites
- 4535US2012154393A1Apparatus and method for creating animation by capturing movements of non-rigid objectsLEE JI-HYUNG·Filed 2011·Application pending·0 cites
- 4634US2016176116A1Apparatus and method for authoring three-dimensional object for three-dimensional printingKOREA ELECTRONICS TELECOMM·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →