Inventor · disambiguated record
Shrikar Bhagath
Also filed as: BHAGATH SHRIKAR
30 granted patents·22 pending applications·170 citations·filing 2000–2024
96Inventor score
Files withTAKIAR HEM16SANDISK CORP12WESTERN DIGITAL TECH INC8SANDISK TECHNOLOGIES INC6SANDISK TECHNOLOGIES LLC3
Top patents by PatentIndex Score
52 records- 0196US11094674B2Memory scaling semiconductor deviceSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Aug 17, 2021·4 cites·20 claims
- 0289US11830849B2Semiconductor device with unbalanced die stackupWESTERN DIGITAL TECH INC·Filed 2021·Granted Nov 28, 2023·2 cites·20 claims
- 0389US7485501B2Method of manufacturing flash memory cardsSANDISK CORP·Filed 2005·Granted Feb 3, 2009·18 cites·23 claims
- 0489US7259028B2Test pads on flash memory cardsSANDISK CORP·Filed 2005·Granted Aug 21, 2007·16 cites·17 claims
- 0587US7816181B1Method of under-filling semiconductor die in a die stack and semiconductor device formed therebySANDISK CORP·Filed 2009·Granted Oct 19, 2010·12 cites·20 claims
- 0687US7795715B2Leadframe based flash memory cardsSANDISK CORP·Filed 2009·Granted Sep 14, 2010·12 cites·13 claims
- 0786US11011500B2Memory scaling semiconductor deviceSANDISK TECHNOLOGIES LLC·Filed 2020·Granted May 18, 2021·2 cites·20 claims
- 0884US6512675B1Heat sink grounded to a grounded package lidADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 28, 2003·43 cites·12 claims
- 0977US8637978B2System-in-a-package based flash memory cardTAKIAR HEM·Filed 2011·Granted Jan 28, 2014·3 cites·16 claims
- 1077US7560304B2Method of making a semiconductor device having multiple die redistribution layerSANDISK CORP·Filed 2006·Granted Jul 14, 2009·7 cites·14 claims
- 1175US8022519B2System-in-a-package based flash memory cardSANDISK TECHNOLOGIES INC·Filed 2005·Granted Sep 20, 2011·5 cites·12 claims
- 1273US8852999B2System-in-a-package based flash memory cardTAKIAR HEM·Filed 2011·Granted Oct 7, 2014·2 cites·9 claims
- 1373US8575724B2Semiconductor device having under-filled die in a die stackBHAGATH SHRIKAR·Filed 2010·Granted Nov 5, 2013·4 cites·7 claims
- 1471US8470640B2Method of fabricating stacked semiconductor package with localized cavities for wire bondingTAKIAR HEM·Filed 2008·Granted Jun 25, 2013·5 cites·15 claims
- 1570US2024371447A1Power reallocation for memory deviceSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1669US7791191B2Semiconductor device having multiple die redistribution layerSANDISK CORP·Filed 2006·Granted Sep 7, 2010·4 cites·20 claims
- 1768US7967184B2Padless substrate for surface mounted componentsSANDISK CORP·Filed 2005·Granted Jun 28, 2011·4 cites·6 claims
- 1867US10290354B1Partial memory dieSANDISK TECHNOLOGIES LLC·Filed 2017·Granted May 14, 2019·2 cites·20 claims
- 1964US7488620B2Method of fabricating leadframe based flash memory cards including singulation by straight line cutsSANDISK CORP·Filed 2005·Granted Feb 10, 2009·2 cites·6 claims
- 2063US12068041B2Power reallocation for memory deviceWESTERN DIGITAL TECH INC·Filed 2021·Granted Aug 20, 2024·0 cites·7 claims
- 2163US2025254893A1Processing core including high capacity low latency storage memorySANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2262US8432043B2Stacked wire bonded semiconductor package with low profile bond lineTAKIAR HEM·Filed 2008·Granted Apr 30, 2013·2 cites·18 claims
- 2362US8294251B2Stacked semiconductor package with localized cavities for wire bondingTAKIAR HEM·Filed 2008·Granted Oct 23, 2012·2 cites·20 claims
- 2459US2025293205A1Processing core including integrated high capacity high bandwidth storage memoryWESTERN DIGITAL TECH INC·Filed 2024·Application pending·0 cites
- 2558US6229219B1Flip chip package compatible with multiple die footprints and method of assembling the sameADVANCED MICRO DEVICES INC·Filed 2000·Granted May 8, 2001·9 cites·1 claims
- 2658US2025239510A1High capacity high bandwidth non-volatile memory deviceSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2756USD548740SSIP based flash memory cardSANDISK CORP·Filed 2005·Granted Aug 14, 2007·10 cites·1 claims
- 2855US2025385152A1Semiconductor device including an integrated wafer level heat sink window plateSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2955US2025391732A1Semiconductor device including an integrated tim-on-dieSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 3053US11552040B2Package process, DAF replacementWESTERN DIGITAL TECH INC·Filed 2020·Granted Jan 10, 2023·0 cites·11 claims
- 3152US2024312916A1Semiconductor Device Package with Die Stackup and InterposerWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 3251US11551991B2Semiconductor device package having cover portion with curved surface profileWESTERN DIGITAL TECH INC·Filed 2020·Granted Jan 10, 2023·0 cites·6 claims
- 3351US7495255B2Test pads on flash memory cardsSANDISK CORP·Filed 2007·Granted Feb 24, 2009·0 cites·17 claims
- 3450US2008131999A1Method of die stacking using insulated wire bondsTAKIAR HEM·Filed 2007·Application pending·0 cites
- 3550US2008128880A1Die stacking using insulated wire bondsTAKIAR HEM·Filed 2007·Application pending·0 cites
- 3649US2007218588A1Integrated circuit package having stacked integrated circuits and method thereforSANDISK CORP·Filed 2007·Application pending·0 cites
- 3748US2008131998A1Method of fabricating a film-on-wire bond semiconductor deviceTAKIAR HEM·Filed 2006·Application pending·0 cites
- 3848US2023137512A1Stacked ssd semiconductor deviceWESTERN DIGITAL TECH INC·Filed 2021·Application pending·0 cites
- 3947US11985782B2Enclosure fitting for electronic deviceWESTERN DIGITAL TECH INC·Filed 2022·Granted May 14, 2024·0 cites·12 claims
- 4047US8241953B2Method of fabricating stacked wire bonded semiconductor package with low profile bond lineTAKIAR HEM·Filed 2008·Granted Aug 14, 2012·0 cites·18 claims
- 4146US2006267173A1Integrated circuit package having stacked integrated circuits and method thereforSANDISK CORP·Filed 2005·Application pending·0 cites
- 4245US2012279651A1Epoxy coating on substrate for die attachGU WEI·Filed 2011·Application pending·0 cites
- 4343US2008237887A1Semiconductor die stack having heightened contact for wire bondTAKIAR HEM·Filed 2007·Application pending·0 cites
- 4443US2008242076A1Method of making semiconductor die stack having heightened contact for wire bondTAKIAR HEM·Filed 2007·Application pending·0 cites
- 4543US2015214184A1Epoxy coating on substrate for die attachSANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD·Filed 2015·Application pending·0 cites
- 4642US10128218B2Semiconductor device including die bond pads at a die edgeSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted Nov 13, 2018·0 cites·24 claims
- 4742US2008128879A1Film-on-wire bond semiconductor deviceTAKIAR HEM·Filed 2007·Application pending·0 cites
- 4841US2009166820A1Tsop leadframe strip of multiply encapsulated packagesTAKIAR HEM·Filed 2007·Application pending·0 cites
- 4940US2007004094A1Method of reducing warpage in an over-molded IC packageTAKIAR HEM·Filed 2005·Application pending·0 cites
- 5040US2007001285A1Apparatus having reduced warpage in an over-molded IC packageTAKIAR HEM·Filed 2005·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →