Inventor · disambiguated record
Shaul Branchevsky
Also filed as: BRANCHEVSKY SHAUL
8 granted patents·6 pending applications·250 citations·filing 1999–2024
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0190US6470545B1Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrateNAT SEMICONDUCTOR CORP·Filed 2000·Granted Oct 29, 2002·59 cites·16 claims
- 0288US6694583B2Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrateNAT SEMICONDUCTOR CORP·Filed 2001·Granted Feb 24, 2004·52 cites·10 claims
- 0387US6252761B1Embedded multi-layer ceramic capacitor in a low-temperature con-fired ceramic (LTCC) substrateNAT SEMICONDUCTOR CORP·Filed 1999·Granted Jun 26, 2001·89 cites·17 claims
- 0483US10729001B2Devices and methods related to metallization of ceramic substrates for shielding applicationsSKYWORKS SOLUTIONS INC·Filed 2015·Granted Jul 28, 2020·3 cites·8 claims
- 0583US2025089154A1Devices and methods related to metallization of ceramic substrates for shielding applicationsSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 0679US6778058B1Embedded 3D coil inductors in a low temperature, co-fired ceramic substrateNAT SEMICONDUCTOR CORP·Filed 2001·Granted Aug 17, 2004·24 cites·11 claims
- 0775US12058806B2Devices and methods related to metallization of ceramic substrates for shielding applicationsSKYWORKS SOLUTIONS INC·Filed 2022·Granted Aug 6, 2024·0 cites·8 claims
- 0873US6408511B1Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrateNAT SEMICONDUCTOR INC·Filed 2000·Granted Jun 25, 2002·23 cites·11 claims
- 0970US11277901B2Methods related to metallization of ceramic substrates for shielding applicationsSKYWORKS SOLUTIONS INC·Filed 2020·Granted Mar 15, 2022·0 cites·13 claims
- 1061US2024363509A1Molded package with interconnect posts with plated solder capsSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 1156US2024087999A1Packaging substrate having metal postsSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 1246US2020321272A1Module with ball grid array having increased die areaSKYWORKS SOLUTIONS INC·Filed 2020·Application pending·0 cites
- 1344US2009159915A1Led insert module and multi-layer lensBRANCHEVSKY SHAUL·Filed 2008·Application pending·0 cites
- 1440US2004239469A1Embedded 3D coil inductors in a low temperature, co-fired ceramic substrateNAT SEMICONDUCTOR CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →