Embedded 3D coil inductors in a low temperature, co-fired ceramic substrate

Abstract

A method for forming an embedded three-dimensional inductor is provided. Generally, a first coil winding is formed. A first dielectric layer is placed on the first coil winding. At least part of second coil winding is formed on the first dielectric layer and part of the first coil winding to create an electrical contact between the first coil winding and the second coil winding. A first tape layer with a cavity is provided, where the first coil winding, the first dielectric layer, and the second coil winding are within the cavity of the first tape layer.

1 - 10 . (Canceled)  
     
     
         11 . A method of forming an embedded three-dimensional inductor, comprising: 
 forming a first coil winding;    placing a first dielectric layer on the first coil winding;    forming at least part of second coil winding on the first dielectric layer and part of the first coil winding to create an electrical contact between the first coil winding and the second coil winding; and    providing a first tape layer with a cavity, wherein the first coil winding, the first dielectric layer, and the second coil winding are within the cavity of the first tape layer.    
     
     
         12 . The method, as recited in  claim 11 , wherein the forming of the second coil winding comprises printing the second coil winding on the first dielectric layer and part of the first coil winding.  
     
     
         13 . The method, as recited in  claim 12 , further comprising a second tape layer, wherein the forming of the first coil winding comprises printing the first coil winding on the second tape layer.  
     
     
         14 . The method, as recited in  claim 13 , wherein forming the at least part of the second coil winding comprises forming a complete second coil winding, and further comprising: 
 placing a second dielectric layer on the second coil winding; and    forming a third coil winding on the second dielectric layer.    
     
     
         15 . The method, as recited in  claim 14 , further comprising firing the first tape layer, the second tape layer, the first, second, and third coil windings, and the first and second dielectric layers together.  
     
     
         16 . The method, as recited in  claim 15 , further comprising the step of creating an electrical connection between the first coil winding and a via in the second tape layer.  
     
     
         17 . The method, as recited in  claim 16 , wherein the placement of the second dielectric layer comprises: 
 placing a first dielectric sheet; and    placing a second dielectric sheet.    
     
     
         18 . The method, as recited in  claim 11 , further comprising firing the first tape layer, the first and second coil windings, and the first dielectric layer together.