Inventor · disambiguated record
Shin-Chi Chen
Also filed as: CHEN SHIN-CHI
28 granted patents·1 pending application·96 citations·filing 2008–2024
95Inventor score
Files withUNITED MICROELECTRONICS CORP11CHEN SHIN-CHI4TAIWAN SEMICONDUCTOR MFG CO LTD3LIAO PO-JUI2CHIEN CHIN-CHENG1
Top patents by PatentIndex Score
29 records- 0190US11620426B2Automated system and method for circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·2 cites·20 claims
- 0288US12001773B2Automated system and method for circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 4, 2024·1 cites·20 claims
- 0385US8710632B2Compound semiconductor epitaxial structure and method for fabricating the sameYU TIEN-WEI·Filed 2012·Granted Apr 29, 2014·13 cites·16 claims
- 0485US8704294B2Semiconductor device having metal gate and manufacturing method thereofLIAO PO-JUI·Filed 2011·Granted Apr 22, 2014·7 cites·8 claims
- 0585US8574990B2Method of manufacturing semiconductor device having metal gateLIAO PO-JUI·Filed 2011·Granted Nov 5, 2013·9 cites·20 claims
- 0683US8952451B2Semiconductor device having metal gate and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 10, 2015·5 cites·8 claims
- 0781US8552503B2Strained silicon structureHWANG GUANG-YAW·Filed 2010·Granted Oct 8, 2013·6 cites·12 claims
- 0881US8298935B2Dual damascene processCHEN SHIN-CHI·Filed 2010·Granted Oct 30, 2012·5 cites·19 claims
- 0979US12367333B2Automated system and method for circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 1079US8883033B2Method for removing nitride materialUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 11, 2014·5 cites·15 claims
- 1179USD712602SAnimal chew toyNATURAL POLYMER INTERNAT CORP·Filed 2013·Granted Sep 2, 2014·23 cites·1 claims
- 1275US10276443B2Insulating layer next to fin structure and method of removing fin structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 30, 2019·2 cites·7 claims
- 1372US9318571B2Gate structure and method for trimming spacersWANG I-CHANG·Filed 2009·Granted Apr 19, 2016·6 cites·8 claims
- 1471US8026571B2Semiconductor-device isolation structureUNITED MICROELECTRONICS CORP·Filed 2008·Granted Sep 27, 2011·6 cites·5 claims
- 1562US9312258B2Strained silicon structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 12, 2016·1 cites·18 claims
- 1662US8232152B2Removing method of a hard maskHSU CHE-HUA·Filed 2010·Granted Jul 31, 2012·2 cites·8 claims
- 1758US7826025B2Attachment process for flexible substrates and patterned sealant with circular point adhesive at opening of frame that has a guiding rib so that opening width increases with distance from frameIND TECH RES INST·Filed 2008·Granted Nov 2, 2010·2 cites·2 claims
- 1856US11764174B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 1955US8999830B2Semiconductor device having metal gate and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 7, 2015·0 cites·27 claims
- 2054US10699913B2Manufacturing method for trenchUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 30, 2020·0 cites·13 claims
- 2152US8252515B2Method for removing photoresistCHIEN CHIN-CHENG·Filed 2009·Granted Aug 28, 2012·0 cites·13 claims
- 2250US8791013B2Pattern forming methodCHEN SHIN-CHI·Filed 2012·Granted Jul 29, 2014·0 cites·19 claims
- 2348US8067282B2Method for selective formation of trenchCHU PIN-CHIEN·Filed 2009·Granted Nov 29, 2011·1 cites·15 claims
- 2446US10199232B2Conductor line structureCHEN SHIN CHI·Filed 2011·Granted Feb 5, 2019·0 cites·7 claims
- 2545US9305847B2Method of manufacturing semiconductor device having gate metalUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 5, 2016·0 cites·10 claims
- 2644US9748333B2Semiconductor structure including dummy structure and semiconductor pattern structure including dummy structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Aug 29, 2017·0 cites·18 claims
- 2742US9245972B2Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jan 26, 2016·0 cites·19 claims
- 2836US8728949B2Method for fabricating a semiconductor deviceSHIH HUNG-LING·Filed 2010·Granted May 20, 2014·0 cites·17 claims
- 2935US2011294075A1Patterning methodCHEN SHIN-CHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →