Inventor · disambiguated record
Shih-Kuang Chen
Also filed as: CHEN SHIH-KUANG
10 granted patents·4 pending applications·313 citations·filing 1999–2018
89Inventor score
Top patents by PatentIndex Score
14 records- 0194US8035213B2Chip package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Oct 11, 2011·124 cites·20 claims
- 0290US6229702B1Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capabilityADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted May 8, 2001·123 cites·19 claims
- 0377US7651937B2Bumping process and structure thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 26, 2010·9 cites·8 claims
- 0472US7518241B2Wafer structure with a multi-layer barrier in an UBM layer network device with power supplyADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Apr 14, 2009·7 cites·14 claims
- 0572US6737353B2Semiconductor device having bump electrodesADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted May 18, 2004·24 cites·5 claims
- 0672US6692581B2Solder paste for fabricating bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·18 cites·12 claims
- 0766US10714528B2Chip package and manufacturing method thereofXINTEC INC·Filed 2018·Granted Jul 14, 2020·1 cites·19 claims
- 0851US2014191350A1Image sensor chip package and fabricating method thereofXINTEC INC·Filed 2014·Application pending·0 cites
- 0947US2016380024A1Image sensor chip package and fabricating method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 1046US9449897B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Sep 20, 2016·0 cites·22 claims
- 1145US9023676B2Wafer packaging methodXINTEC INC·Filed 2014·Granted May 5, 2015·0 cites·14 claims
- 1245US6716736B2Method for manufacturing an under-bump metallurgy layerADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 6, 2004·7 cites·7 claims
- 1340US2007108612A1Chip structure and manufacturing method of the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1433US2003141591A1Under bump structure and process for producing the sameFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →