Inventor · disambiguated record
Sheng-Yu Chen
Also filed as: CHEN SHENG S · CHEN SHENG-YU
11 granted patents·7 pending applications·4 citations·filing 2005–2025
82Inventor score
Files withADVANCED SEMICONDUCTOR ENG12CHEN SHENG-YU2INST NUCLEAR ENERGY RES1MICRO FOCUS LLC1UNITED MICROELECTRONICS CORP1
Top patents by PatentIndex Score
18 records- 0191US12364008B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 15, 2025·1 cites·9 claims
- 0286US11997888B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted May 28, 2024·1 cites·16 claims
- 0384US2025344505A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0481US11224132B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 11, 2022·2 cites·19 claims
- 0580US12089349B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Sep 10, 2024·0 cites·15 claims
- 0674US11744024B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Aug 29, 2023·0 cites·14 claims
- 0770US11942385B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Mar 26, 2024·0 cites·14 claims
- 0862US2025076245A1Method and system for establishing model for sensing ions in solution, and method and system for sensing ions in solutionUNIV NAT TAIWAN·Filed 2023·Application pending·0 cites
- 0961US11437415B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 6, 2022·0 cites·19 claims
- 1060US11289394B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 29, 2022·0 cites·19 claims
- 1155US11201200B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 14, 2021·0 cites·15 claims
- 1252US11081473B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 3, 2021·0 cites·21 claims
- 1350US2025284475A1Java-Based Application Inventory DiscoveryMICRO FOCUS LLC·Filed 2024·Application pending·0 cites
- 1444US2007060028A1Cmp slurry delivery system and method of mixing slurry thereofCHEN SHENG-YU·Filed 2006·Application pending·0 cites
- 1542US2006272943A1A versatile electrochemical sensor for sensing fuel concentration in an aqueous solutionINST NUCLEAR ENERGY RES·Filed 2005·Application pending·0 cites
- 1642US2020312733A1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 1740US2006191871A1Cmp slurry delivery system and method of mixing slurry thereofCHEN SHENG-YU·Filed 2005·Application pending·0 cites
- 1835US7223157B2Chemical-mechanical polishing apparatus and method of conditioning polishing padUNITED MICROELECTRONICS CORP·Filed 2005·Granted May 29, 2007·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →