Inventor · disambiguated record

Shaw-Wei Chen

Also filed as: CHEN SHAW-WEI

2 granted patents·11 citations·filing 2004–2004

53Inventor score

Technology areasH10W

Files withGLOBAL ADVANCED PACKAGING TECH2

Top patents by PatentIndex Score

2 records

0156US7098524B2Electroplated wire layout for package sawingGLOBAL ADVANCED PACKAGING TECH·Filed 2004·Granted Aug 29, 2006·10 cites·7 claims
0239US7095091B2Packaging stacked chips with finger structureGLOBAL ADVANCED PACKAGING TECH·Filed 2004·Granted Aug 22, 2006·1 cites·6 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →