Inventor · disambiguated record

Shing-Chao Chen

Also filed as: CHEN SHING-CHAO

22 granted patents·2 pending applications·54 citations·filing 2014–2025

93Inventor score

Technology areasH10W H10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD24

Top patents by PatentIndex Score

24 records

0196US11177156B2Semiconductor package, manufacturing method of semiconductor device and semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·10 cites·20 claims
0293US11088124B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 10, 2021·7 cites·20 claims
0392US9425178B2RDL-first packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·13 cites·20 claims
0491US10128193B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 13, 2018·8 cites·20 claims
0590US10515900B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·3 cites·20 claims
0690US2025349808A1Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0788US10157846B2Method for forming chip package involving cutting processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·3 cites·20 claims
0887US11404381B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·2 cites·20 claims
0987US10950572B2Die bonder and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·3 cites·20 claims
1086US12444719B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
1185US2025285905A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1282US12322640B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
1382US10797038B2Semiconductor package and rework process for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 6, 2020·4 cites·20 claims
1481US12125797B2Package structure with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
1577US12080653B2Formation method of chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
1675US11776838B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
1774US12033992B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
1866US10475764B2Die bonder and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 12, 2019·1 cites·20 claims
1963US10964663B2Die bonder and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
2056US10840111B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 17, 2020·0 cites·20 claims
2154US10867953B2Manufacturing method of integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
2252US9947552B2Structure and formation method of chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 17, 2018·0 cites·19 claims
2351US10276537B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·13 claims
2449US10283470B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →