Inventor · disambiguated record
Sheng-Chau Chen
Also filed as: CHEN SHENG-CHAU
96 granted patents·50 pending applications·508 citations·filing 2013–2025
99Inventor score
Top patents by PatentIndex Score
146 records- 0199US9437572B2Conductive pad structure for hybrid bonding and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 6, 2016·227 cites·20 claims
- 0298US11715674B2Trim wall protection method for multi-wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·4 cites·20 claims
- 0398US11152276B2Trim wall protection method for multi-wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 19, 2021·17 cites·20 claims
- 0498US10163651B1Structure and method to expose memory cells with different sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·32 cites·20 claims
- 0598US9704827B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 11, 2017·32 cites·20 claims
- 0697US11664411B2Semiconductor structure having integrated inductor thereinTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 30, 2023·4 cites·20 claims
- 0797US11581254B2Three dimensional MIM capacitor having a comb structure and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·4 cites·20 claims
- 0897US11011600B2Semiconductor structure having integrated inductor thereinTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 18, 2021·5 cites·20 claims
- 0997US10529913B1Techniques for MRAM MTJ top electrode connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·15 cites·20 claims
- 1096US12027554B2Composite deep trench isolation structure in an image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 2, 2024·3 cites·20 claims
- 1195US10164001B1Semiconductor structure having integrated inductor thereinTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·11 cites·20 claims
- 1295US10050018B23DIC structure and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·12 cites·20 claims
- 1395US10043705B2Memory device and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 7, 2018·13 cites·20 claims
- 1494US11901387B2Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·2 cites·20 claims
- 1594US11735624B2Multi-lateral recessed MIM structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·2 cites·20 claims
- 1693US9281331B2High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 8, 2016·16 cites·12 claims
- 1792US11183627B2MRAM MTJ top electrode connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 23, 2021·2 cites·20 claims
- 1892US11081334B2Particle prevention in wafer edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·6 cites·20 claims
- 1992US9666566B13DIC structure and method for hybrid bonding semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·9 cites·20 claims
- 2092US9653507B2Deep trench isolation shrinkage method for enhanced device performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·7 cites·21 claims
- 2192US9040385B2Mechanisms for cleaning substrate surface for hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 26, 2015·24 cites·20 claims
- 2291US10541297B2Semiconductor structure having integrated inductor thereinTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 21, 2020·5 cites·20 claims
- 2391US2025089387A1Methods for manufacturing semiconductor structure and back-side illuminated image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2490US9960200B1Selective deposition and planarization for a CMOS image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·7 cites·20 claims
- 2589US11735617B2Semiconductor structure, back-side illuminated image sensor and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·1 cites·20 claims
- 2689US9837291B2Wafer processing method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 5, 2017·7 cites·20 claims
- 2788US11908878B2Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·1 cites·20 claims
- 2888US11049767B2Semiconductor device and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·4 cites·20 claims
- 2988US2025338658A1Stacked structure for cmos image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3087US12183761B2Semiconductor structure, back-side illuminated image sensor and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 3187US11925033B2Embedded backside memory on a field effect transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·1 cites·20 claims
- 3287US11804473B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·1 cites·20 claims
- 3387US10283550B2Semiconductor structure, back-side illuminated image sensor and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·3 cites·20 claims
- 3487US2025366248A1Isolation structure having an air gap to reduce pixel crosstalkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3586US12302663B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 3686US2025349597A1Image sensor with dual trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3786US2025255193A1Techniques for conductive structure connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3886US2025366245A1Semiconductor isolation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3986US2025366244A1Semiconductor isolation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4085US12490538B2Stacked structure for CMOS image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 4185US11183394B2Structure and method to expose memory cells with different sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 23, 2021·1 cites·20 claims
- 4284US12300670B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 4384US12290003B2Conductive structure connection with interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 4484US11682652B2Notched wafer and bonding support structure to improve wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·1 cites·20 claims
- 4583US9859323B1Complementary metal-oxide-semiconductor (CMOS) image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·4 cites·20 claims
- 4683US9842816B2Conductive pad structure for hybrid bonding and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 12, 2017·3 cites·20 claims
- 4783US2025366252A1Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4883US2024395843A1Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4982US12113090B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 5082US11121315B2Structure improving reliability of top electrode contact for resistance switching RAM having cells of varying heightTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·1 cites·20 claims
Showing the top 50 of 146 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →