Inventor · disambiguated record
Shih-Lian Cheng
Also filed as: CHENG SHIH-LIAN
25 granted patents·11 pending applications·55 citations·filing 2005–2025
92Inventor score
Files withUNIMICRON TECHNOLOGY CORP29SUBTRON TECHNOLOGY CO LTD3CHEN TSUNG-YUAN1CHENG SHIH-LIAN1SABTRON TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
36 records- 0193US7223687B1Printed wiring board and method of fabricating the sameSUBTRON TECHNOLOGY CO LTD·Filed 2006·Granted May 29, 2007·36 cites·15 claims
- 0287US9161454B2Electrical device package structure and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2012·Granted Oct 13, 2015·8 cites·4 claims
- 0387US8604359B2Package substrate and fabrication method thereofCHEN TSUNG-YUAN·Filed 2011·Granted Dec 10, 2013·8 cites·6 claims
- 0475US2025393127A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0574US12052815B2Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Jul 30, 2024·0 cites·15 claims
- 0672US11686008B2Electroplating apparatus and electroplating methodUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jun 27, 2023·0 cites·19 claims
- 0769US2024282687A1Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0865US11785707B2Circuit board and manufacturing method thereof and electronic deviceUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 10, 2023·0 cites·9 claims
- 0962US10999935B2Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted May 4, 2021·0 cites·4 claims
- 1061US10813223B2Piezochromic stampUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Oct 20, 2020·0 cites·1 claims
- 1161US2025239511A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1260US11859302B2Electroplating apparatus and electroplating methodUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jan 2, 2024·0 cites·10 claims
- 1360US7441329B2Fabrication process circuit board with embedded passive componentSUBTRON TECHNOLOGY CO LTD·Filed 2005·Granted Oct 28, 2008·2 cites·10 claims
- 1460US2025239558A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1559US12057381B2Circuit board having laminated build-up layersUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 6, 2024·0 cites·9 claims
- 1659US10512166B2Manufacturing method of circuit board and stampUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Dec 17, 2019·0 cites·6 claims
- 1758US10426038B2Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Sep 24, 2019·0 cites·13 claims
- 1858US10098234B2Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Oct 9, 2018·0 cites·1 claims
- 1957US11366381B2Mask structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 21, 2022·0 cites·4 claims
- 2056US10362682B2Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jul 23, 2019·0 cites·4 claims
- 2155US2025203776A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2255US2024414850A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2354US11895773B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Feb 6, 2024·0 cites·11 claims
- 2454US11818833B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Nov 14, 2023·0 cites·10 claims
- 2554US8955218B2Method for fabricating package substrateUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Feb 17, 2015·0 cites·4 claims
- 2654US2023120741A1Electroplating apparatus and electroplating methodUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2753US11737206B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Aug 22, 2023·0 cites·10 claims
- 2853US10324370B2Manufacturing method of circuit substrate and mask structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jun 18, 2019·0 cites·10 claims
- 2953US7674672B2Fabricating process for substrate with embedded passive componentSABTRON TECHNOLOGY CO LTD·Filed 2009·Granted Mar 9, 2010·1 cites·24 claims
- 3051US11910535B2Printed circuit board stack structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Feb 20, 2024·0 cites·6 claims
- 3151US2023328900A1Circuit board and circuit board module with docking structure and manufacture method of the circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 3249US2009196979A1Inkjet printing process for circuit boardSUBTRON TECHNOLOGY CO LTD·Filed 2008·Application pending·0 cites
- 3348US10271433B2Method of fabricating an electrical device package structureUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Apr 23, 2019·0 cites·6 claims
- 3441US10820411B1Manufacturing method for circuit board and circuit board thereofUNIMICRON TECH CORPORATION·Filed 2020·Granted Oct 27, 2020·0 cites·10 claims
- 3539US2012313240A1Semiconductor package and fabrication method thereofCHENG SHIH-LIAN·Filed 2011·Application pending·0 cites
- 3636US2014263168A1Method for manufacturing package substrateUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →