Inventor · disambiguated record
Shinichi Chikaki
Also filed as: CHIKAKI SHINICHI
14 granted patents·4 pending applications·276 citations·filing 1988–2011
92Inventor score
Top patents by PatentIndex Score
18 records- 0191US5844304AProcess for manufacturing semiconductor device and semiconductor waferNEC CORP·Filed 1995·Granted Dec 1, 1998·120 cites·12 claims
- 0289US5542874AWafer polishing apparatusNEC CORP·Filed 1994·Granted Aug 6, 1996·67 cites·4 claims
- 0386US8330276B2Semiconductor device and method for manufacturing the sameODA NORIAKI·Filed 2010·Granted Dec 11, 2012·10 cites·12 claims
- 0486US8310056B2Semiconductor deviceODA NORIAKI·Filed 2010·Granted Nov 13, 2012·10 cites·20 claims
- 0582US8592990B2Semiconductor device and method of manufacturing semiconductor deviceCHIKAKI SHINICHI·Filed 2011·Granted Nov 26, 2013·6 cites·7 claims
- 0677US7646101B2Semiconductor device and manufacturing method thereofROHM CO LTD·Filed 2007·Granted Jan 12, 2010·6 cites·3 claims
- 0772US8022497B2Semiconductor device comprising insulating filmSANYO ELECTRIC CO·Filed 2007·Granted Sep 20, 2011·4 cites·14 claims
- 0864USRE39603EProcess for manufacturing semiconductor device and semiconductor waferNEC ELECTRONICS CORP·Filed 2003·Granted May 1, 2007·10 cites·22 claims
- 0958US8384208B2Semiconductor device and method of fabricating the sameSANYO ELECTRIC CO·Filed 2007·Granted Feb 26, 2013·2 cites·6 claims
- 1055US5649855AWafer polishing deviceNEC CORP·Filed 1996·Granted Jul 22, 1997·18 cites·9 claims
- 1151US4907039ASemiconductor deviceNEC CORP·Filed 1988·Granted Mar 6, 1990·17 cites·13 claims
- 1249US8981563B2Semiconductor device and method of manufacturing the sameCHIKAKI SHINICHI·Filed 2009·Granted Mar 17, 2015·0 cites·13 claims
- 1348US2011092071A1Method of producing silylated porous insulating film, method of producing semiconductor device, and silylated materialRENESAS ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1446US8273410B2Process for manufacturing hydrophobized microporous filmCHIKAKI SHINICHI·Filed 2008·Granted Sep 25, 2012·0 cites·8 claims
- 1543US2007269977A1Method of forming a multilayer wiring by the use of copper damascene techniqueNEC CORP·Filed 2007·Application pending·0 cites
- 1638US5483717ACleaning system using acrylic emulsion for semiconductor wafersNEC CORP·Filed 1994·Granted Jan 16, 1996·6 cites·8 claims
- 1737US2010301495A1Semiconductor device and method for manufacturing sameNEC ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 1834US2012003841A1Method of producing semiconductor deviceCHIKAKI SHINICHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →