Inventor · disambiguated record
Shuji Eguchi
Also filed as: EGUCHI SHUJI
43 granted patents·3 pending applications·1,290 citations·filing 1983–2008
98Inventor score
Top patents by PatentIndex Score
46 records- 0194US6028364ASemiconductor device having a stress relieving mechanismHITACHI LTD·Filed 1995·Granted Feb 22, 2000·167 cites·19 claims
- 0291US6627997B1Semiconductor module and method of mountingHITACHI LTD·Filed 1999·Granted Sep 30, 2003·124 cites·8 claims
- 0389US7359212B2Control device and method of manufacturing thereofHITACHI LTD·Filed 2005·Granted Apr 15, 2008·16 cites·13 claims
- 0489US6114005ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1997·Granted Sep 5, 2000·98 cites·19 claims
- 0588US6114753ACircuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 1997·Granted Sep 5, 2000·50 cites·23 claims
- 0688US5677045ALaminate and multilayer printed circuit boardHITACHI LTD·Filed 1995·Granted Oct 14, 1997·86 cites·8 claims
- 0787US7445455B2Electronic deviceHITACHI LTD·Filed 2005·Granted Nov 4, 2008·17 cites·2 claims
- 0887US6784541B2Semiconductor module and mounting method for sameHITACHI LTD·Filed 2002·Granted Aug 31, 2004·37 cites·10 claims
- 0985US5914531ASemiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1997·Granted Jun 22, 1999·68 cites·21 claims
- 1083US6423571B2Method of making a semiconductor device having a stress relieving mechanismHITACHI LTD·Filed 2001·Granted Jul 23, 2002·35 cites·19 claims
- 1182US4585841ATransparent resin material containing metallic atoms bonded to pendent carboxylic acid groupsHITACHI LTD·Filed 1983·Granted Apr 29, 1986·30 cites·30 claims
- 1280US6940162B2Semiconductor module and mounting method for sameRENESAS TECH CORP·Filed 2004·Granted Sep 6, 2005·23 cites·24 claims
- 1380US4946242AOptical part including integral combination of optical fiber and light emitting or receiving element and method of manufacturing the sameHITACHI LTD·Filed 1988·Granted Aug 7, 1990·34 cites·37 claims
- 1478US5602420AStacked high mounting density semiconductor devicesHITACHI LTD·Filed 1995·Granted Feb 11, 1997·65 cites·30 claims
- 1577US6097100AResin sealed semiconductor devices and a process for manufacturing the sameHITACHI LTD·Filed 1997·Granted Aug 1, 2000·56 cites·16 claims
- 1675US7924572B2Control device and method of manufacturing thereofHITACHI LTD·Filed 2008·Granted Apr 12, 2011·5 cites·2 claims
- 1775US6114192AMethod of manufacturing a semiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1998·Granted Sep 5, 2000·39 cites·38 claims
- 1875US5145579AMethod of manufacturing a separation columnPHILIPS CORP·Filed 1991·Granted Sep 8, 1992·34 cites·4 claims
- 1971US6791194B1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 14, 2004·18 cites·18 claims
- 2071US6371664B2Photoelectronic device and method of manufacturing the sameHITACHI LTD·Filed 2001·Granted Apr 16, 2002·17 cites·17 claims
- 2171US6282350B1Photoelectronic device and method of manufacturing the sameHITACHI LTD·Filed 1999·Granted Aug 28, 2001·35 cites·32 claims
- 2271US5113477APlastic optical fibers from polymers derived from metallic salts of ethylenic carboxyl monomersHITACHI LTD·Filed 1990·Granted May 12, 1992·20 cites·11 claims
- 2368US6307269B1Semiconductor device with chip size packageHITACHI LTD·Filed 1998·Granted Oct 23, 2001·32 cites·23 claims
- 2467US6586105B2Packaging structure and method for automotive componentsHITACHI LTD·Filed 2001·Granted Jul 1, 2003·14 cites·14 claims
- 2567US6515371B2Semiconductor device with elastic structure and wiringHITACHI LTD·Filed 2001·Granted Feb 4, 2003·13 cites·8 claims
- 2665US6433440B1Semiconductor device having a porous buffer layer for semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·24 cites·19 claims
- 2764US7303406B2Device for controlling a vehicleHITACHI LTD·Filed 2006·Granted Dec 4, 2007·2 cites·9 claims
- 2862US6686226B1Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frameRENESAS TECH CORP·Filed 2000·Granted Feb 3, 2004·9 cites·22 claims
- 2962US6049128ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Apr 11, 2000·21 cites·10 claims
- 3061US7202570B2Circuit tape having adhesive film semiconductor device and a method for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Apr 10, 2007·6 cites·23 claims
- 3161US6130112ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Oct 10, 2000·20 cites·7 claims
- 3258US5082559AGlass chromatography capillary with relatively thick coatingPHILIPS CORP·Filed 1990·Granted Jan 21, 1992·17 cites·2 claims
- 3357US6639323B2Semiconductor device and its manufacturing methodHITACHI LTD·Filed 2001·Granted Oct 28, 2003·6 cites·29 claims
- 3455US7554039B2Electronic deviceHITACHI LTD·Filed 2003·Granted Jun 30, 2009·5 cites·9 claims
- 3554US6888230B1Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 1999·Granted May 3, 2005·16 cites·20 claims
- 3653US6861294B2Semiconductor devices and methods of making the devicesRENESAS TECH CORP·Filed 2003·Granted Mar 1, 2005·4 cites·9 claims
- 3751US7530819B2Device for controlling a vehicleHITACHI LTD·Filed 2007·Granted May 12, 2009·0 cites·6 claims
- 3851US7038325B2Wiring tape for semiconductor device including a buffer layer having interconnected foamsRENESAS TECH CORP·Filed 2004·Granted May 2, 2006·3 cites·9 claims
- 3950US7217992B2Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted May 15, 2007·3 cites·12 claims
- 4049US4873030AMethod of molding a resinous optical transmitting elementHITACHI LTD·Filed 1988·Granted Oct 10, 1989·12 cites·11 claims
- 4147US7018218B2Device for controlling a vehicleHITACHI CAR ENG CO LTD·Filed 2003·Granted Mar 28, 2006·2 cites·15 claims
- 4246US6297073B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Oct 2, 2001·1 cites·8 claims
- 4340US2002160185A1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameFiled 2002·Application pending·0 cites
- 4440US2002158343A1Semiconductor device and wiring tape for semiconductor deviceFiled 2002·Application pending·0 cites
- 4540US2004061220A1Semiconductor device and manufacturing method thereofFiled 2003·Application pending·0 cites
- 4632US4810048AMechanical part mounting chassis with integrated circuitHITACHI LTD·Filed 1985·Granted Mar 7, 1989·6 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Shuji Eguchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →