Inventor · disambiguated record
Sheng-Hsiang Fu
Also filed as: FU SHENG-HSIANG
3 granted patents·0 citations·filing 2011–2022
43Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0150US12424567B2Chip package and manufacturing method thereofXINTEC INC·Filed 2022·Granted Sep 23, 2025·0 cites·25 claims
- 0239US8502393B2Chip package and method for forming the sameLIN CHAO-YEN·Filed 2012·Granted Aug 6, 2013·0 cites·8 claims
- 0336US8294275B2Chip package and method for forming the sameLIN CHAO-YEN·Filed 2011·Granted Oct 23, 2012·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →