Inventor · disambiguated record
Shogo Fukui
Also filed as: FUKUI SHOGO
11 granted patents·7 pending applications·12 citations·filing 2016–2025
82Inventor score
Top patents by PatentIndex Score
18 records- 0185US10553421B2Substrate processing apparatus, substrate processing method and storage mediumTOKYO ELECTRON LTD·Filed 2016·Granted Feb 4, 2020·6 cites·26 claims
- 0280US11715648B2Substrate processing apparatus and substrate drying methodTOKYO ELECTRON LTD·Filed 2020·Granted Aug 1, 2023·2 cites·12 claims
- 0380US11515142B2Method of cleaning substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2020·Granted Nov 29, 2022·2 cites·18 claims
- 0474US11626298B2Liquid supply device and liquid supply methodTOKYO ELECTRON LTD·Filed 2018·Granted Apr 11, 2023·2 cites·17 claims
- 0563US2025167011A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0663US2025232988A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0761US12237177B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Granted Feb 25, 2025·0 cites·9 claims
- 0860US12476195B2Wiring substrateIBIDEN CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0959US12300518B2Substrate processing apparatus and substrate processing method having enhanced configuration of replenishing processing liquidTOKYO ELECTRON LTD·Filed 2022·Granted May 13, 2025·0 cites·8 claims
- 1059US2024237221A9Method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 1158US2024096650A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1257US12309920B2Wiring substrateIBIDEN CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 1355US2025336690A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1454US2024206061A1Wiring substrateIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 1553US2025140585A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1646US11344931B2Method of removing particles of substrate processing apparatus, and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted May 31, 2022·0 cites·20 claims
- 1744US11133176B2Substrate processing method, recording medium and substrate processing systemTOKYO ELECTRON LTD·Filed 2018·Granted Sep 28, 2021·0 cites·6 claims
- 1833US11084072B2Substrate processing apparatus, substrate processing method and recording mediumTOKYO ELECTRON LTD·Filed 2018·Granted Aug 10, 2021·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →