Inventor · disambiguated record
Shuai Guo
Also filed as: GUO SHUAI
38 granted patents·19 pending applications·234 citations·filing 2005–2024
96Inventor score
Files withCHANGXIN MEMORY TECH INC24LENOVO BEIJING LTD6YANGTZE MEMORY TECH CO LTD5HENGDIAN GROUP DMEGC MAGNETICS CO LTD3MOBVOI INFORMATION TECH COMPANY LIMITED3
Top patents by PatentIndex Score
57 records- 0198US11587949B1Method of manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 21, 2023·6 cites·20 claims
- 0297US10886256B2Methods and systems for wafer bonding alignment compensationYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 5, 2021·4 cites·21 claims
- 0397USD847794SEarphoneMOBVOI INFORMATION TECH COMPANY LIMITED·Filed 2018·Granted May 7, 2019·115 cites·1 claims
- 0494US11508731B1Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Nov 22, 2022·3 cites·15 claims
- 0592US10529694B2Methods and systems for wafer bonding alignment compensationYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jan 7, 2020·6 cites·20 claims
- 0690USD1001811SComputer mainframeLENOVO BEIJING LTD·Filed 2022·Granted Oct 17, 2023·12 cites·1 claims
- 0789US10553565B2Methods and systems for adjusting wafer deformation during wafer bondingYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Feb 4, 2020·5 cites·20 claims
- 0888USD945402SEarphoneMOBVOI INFORMATION TECH COMPANY LIMITED·Filed 2020·Granted Mar 8, 2022·16 cites·1 claims
- 0987USD885367SIntelligent speakerMOBVOI INFORMATION TECH CO LTD·Filed 2017·Granted May 26, 2020·30 cites·1 claims
- 1079US11085296B2Method for controlling subsidence area caused by underground mining in adjoining open-pit mineUNIV CHINA MINING·Filed 2017·Granted Aug 10, 2021·5 cites·4 claims
- 1177USD882548SIntelligent speakerMOBVOI INFORMATION TECH CO LTD·Filed 2017·Granted Apr 28, 2020·17 cites·1 claims
- 1276USD940073SEarphone charging boxMOBVOI INFORMATION TECH COMPANY LIMITED·Filed 2020·Granted Jan 4, 2022·7 cites·1 claims
- 1374US10679854B2Wafer bonding method and structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jun 9, 2020·2 cites·19 claims
- 1464US9130382B1Charging protection circuitLUO YIBAO·Filed 2012·Granted Sep 8, 2015·4 cites·20 claims
- 1561US2023380147A1Manufacturing method of semiconductor device and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 1660US11342185B2Wafer bonding method and structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted May 24, 2022·0 cites·16 claims
- 1759US12302549B2Semiconductor memory structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 13, 2025·0 cites·5 claims
- 1858US12262522B2Method for fabricating semiconductor structure, semiconductor structure, and memoryCHANGXIN MEMORY TECH INC·Filed 2022·Granted Mar 25, 2025·0 cites·15 claims
- 1958US2024071916A1Manufacturing method of semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 2057US12051608B2Method for adjusting wafer deformation and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jul 30, 2024·0 cites·17 claims
- 2157US11778804B2Capacitor array structure and fabrication method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 3, 2023·0 cites·15 claims
- 2257US2023389271A1Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 2357US2023276617A1Semiconductor structure and fabrication method thereforCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 2457US2023282572A1Method for manufacturing semiconductor device and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 2556US2015190453A1Herbal Composition and a Method for the Treatment of Hyperlipidemia Caused by Excessive Consumption of AlcoholGUO SHUAI·Filed 2014·Application pending·0 cites
- 2655US12513885B2Method for forming semiconductor device and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 30, 2025·0 cites·18 claims
- 2755US12369429B2All-black crystalline silicon solar cell and preparation method therefor, and photovoltaic moduleHENGDIAN GROUP DMEGC MAGNETICS CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·12 claims
- 2855USD1030756SHead mounted display deviceLENOVO BEIJING LTD·Filed 2023·Granted Jun 11, 2024·1 cites·1 claims
- 2955US2022359894A1Battery water pump control method, battery controller and batteryCERES IP CO LTD·Filed 2020·Application pending·0 cites
- 3055US2023084851A1Storage device and method for forming storage deviceCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 3154US11626408B2Memory device and forming method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Apr 11, 2023·0 cites·20 claims
- 3254US8997292B2Extended-span and alternatively-shaped arch bridge and construction method thereforLI YONG·Filed 2011·Granted Apr 7, 2015·1 cites·7 claims
- 3354US2023142435A1Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 3453US12046472B2Method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jul 23, 2024·0 cites·15 claims
- 3552US12218220B2Manufacturing method of semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 4, 2025·0 cites·17 claims
- 3652US2022302119A1Dram and formation method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 3751US12317503B2Memory device, and manufacturing method and driving method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 27, 2025·0 cites·13 claims
- 3851US12014994B2Method for forming overlay marks and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jun 18, 2024·0 cites·14 claims
- 3951US11935785B2Method of manufacturing a semiconductor structure, and a semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Mar 19, 2024·0 cites·19 claims
- 4051US2011074530A1Mixed rare-earth permanent magnet and method of fabricationGEN ELECTRIC·Filed 2009·Application pending·0 cites
- 4150US11864371B2Method for manufacturing semiconductor structure and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 2, 2024·0 cites·12 claims
- 4250US2021384090A1Auxiliary wafer, preparation method of auxiliary wafer, and semiconductor production processCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 4349USD1107698SComputer mainframeLENOVO BEIJING LTD·Filed 2024·Granted Dec 30, 2025·0 cites·1 claims
- 4449USD1089215SComputer mainframeLENOVO BEIJING LTD·Filed 2024·Granted Aug 19, 2025·0 cites·1 claims
- 4549US2011236246A1Method of fabrication of mixed rare-earth permanent magnetGEN ELECTRIC·Filed 2011·Application pending·0 cites
- 4649US2022293772A1Method for Manufacturing Semiconductor Structure and Semiconductor StructureCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 4747US12237433B2Double-sided solar cell and preparation method thereforHENGDIAN GROUP DMEGC MAGNETICS CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·19 claims
- 4847US2025038001A1Preparation method and application of crystalline silicon solar cell having shallow junction diffusion emitterHENGDIAN GROUP DMEGC MAGNETICS CO LTD·Filed 2022·Application pending·0 cites
- 4944USD1089184SLaptop computerLENOVO BEIJING LTD·Filed 2024·Granted Aug 19, 2025·0 cites·1 claims
- 5044US11711153B2Wireless signal performance adjustment apparatus and method and wireless communication terminalZTE CORP·Filed 2020·Granted Jul 25, 2023·0 cites·17 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →