Inventor · disambiguated record
Shin Hirano
Also filed as: HIRANO SHIN · HIRANO SHIN-ICHI
19 granted patents·6 pending applications·277 citations·filing 1984–2022
95Inventor score
Top patents by PatentIndex Score
25 records- 0189US8110749B2Printed wiring boardYOSHIMURA HIDEAKI·Filed 2009·Granted Feb 7, 2012·20 cites·4 claims
- 0281US6884364B2Lead-free piezoelectric ceramic composition wherin Cu is contained in (KxA1-x)y(Nb1-zBz)O3perovskite compound, and process of preparing the sameINST NAGOYA IND SCIENCE RES·Filed 2003·Granted Apr 26, 2005·24 cites·14 claims
- 0381US4545968AMethods for preparing cubic boron nitride sintered body and cubic boron nitride, and method for preparing boron nitride for use in the sameTOSHIBA TUNGALOY CO LTD·Filed 1984·Granted Oct 8, 1985·36 cites·23 claims
- 0477US8186052B2Method of producing substrateIIDA KENJI·Filed 2008·Granted May 29, 2012·8 cites·11 claims
- 0577US4731303ACubic boron nitride coated material and producing method of the sameTOSHIBA TUNGALOY CO LTD·Filed 1986·Granted Mar 15, 1988·26 cites·8 claims
- 0676US8151456B2Method of producing substrateMAEHARA YASUTOMO·Filed 2008·Granted Apr 10, 2012·9 cites·5 claims
- 0776US6027796AMesoporous ceramic film with one dimensional through channels and process for its productionAGENCY IND SCIENCE TECHN·Filed 1997·Granted Feb 22, 2000·51 cites·6 claims
- 0873US4590034AMethod for preparing sintered body containing cubic boron nitride and method for preparing cubic boron nitrideTOSHIBA TUNGALOY CO LTD·Filed 1985·Granted May 20, 1986·27 cites·10 claims
- 0970US8178791B2Wiring substrate including conductive core substrate, and manufacturing method thereofABE TOMOYUKI·Filed 2008·Granted May 15, 2012·4 cites·20 claims
- 1068US4762729AMethod of producing cubic boron nitride coated materialTOSHIBA TUNGALOY CO LTD·Filed 1987·Granted Aug 9, 1988·18 cites·6 claims
- 1165US8035037B2Core substrate and method of producing the sameFUJITSU LTD·Filed 2008·Granted Oct 11, 2011·2 cites·10 claims
- 1263US8153908B2Circuit board and method of producing the sameIIDA KENJI·Filed 2008·Granted Apr 10, 2012·2 cites·6 claims
- 1363US8119925B2Core substrate and printed wiring boardYOSHIMURA HIDEAKI·Filed 2009·Granted Feb 21, 2012·2 cites·7 claims
- 1459US2009098391A1Core member and method of producing the sameFUJITSU LTD·Filed 2008·Application pending·0 cites
- 1551US8119923B2Circuit boardYOSHIMURA HIDEAKI·Filed 2008·Granted Feb 21, 2012·0 cites·4 claims
- 1649US2009095509A1Core substrate and method of producing the sameFUJITSU LTD·Filed 2008·Application pending·0 cites
- 1743US2024064907A1Circuit board, method for manufacturing circuit board, and electronic deviceFICT LTD·Filed 2022·Application pending·0 cites
- 1843US2004224835A1Ceramic carrier and production method thereofDENSO CORP·Filed 2004·Application pending·0 cites
- 1940US5440522AConnection/disconnection control circuit for data lines between memory groupsNEC CORP·Filed 1994·Granted Aug 8, 1995·8 cites·15 claims
- 2040US2023180398A1Circuit board, method for manufacturing circuit board, and electronic deviceFICT LTD·Filed 2021·Application pending·0 cites
- 2139US5026684AProcess for preparing ceramic superconductive substancesDOW CORNING·Filed 1989·Granted Jun 25, 1991·7 cites·17 claims
- 2239US2022322534A1Circuit board, method for manufacturing circuit board, and electronic deviceFUJITSU INTERCONNECT TECH LIMITED·Filed 2020·Application pending·0 cites
- 2336US6269328B1Testing integrated circuit deviceNEC CORP·Filed 1998·Granted Jul 31, 2001·7 cites·4 claims
- 2436US5211637ADevice for connecting catheter and injection tubeTOKAI RIKA CO LTD·Filed 1990·Granted May 18, 1993·20 cites·1 claims
- 2534US5275843AManufacture of β-BaB2 O4 film by a sol-gel methodNGK SPARK PLUG CO·Filed 1992·Granted Jan 4, 1994·6 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →