Inventor · disambiguated record
Shunichiro Hirosawa
Also filed as: HIROSAWA SHUNICHIRO
6 granted patents·3 pending applications·11 citations·filing 2011–2025
69Inventor score
Technology areasH10P
Top patents by PatentIndex Score
9 records- 0179US8486806B2Method for machining wafers by cutting partway through a peripheral surplus region to form break starting pointsHIROSAWA SHUNICHIRO·Filed 2011·Granted Jul 16, 2013·11 cites·2 claims
- 0270US2025262690A1Method of processing monocrystalline silicon waferDISCO CORP·Filed 2025·Application pending·0 cites
- 0365US12311470B2Method of processing monocrystalline silicon waferDISCO CORP·Filed 2022·Granted May 27, 2025·0 cites·5 claims
- 0456US2025379071A1Ultraviolet irradiation system, ultraviolet irradiation method, and method of manufacturing chipsDISCO CORP·Filed 2025·Application pending·0 cites
- 0552US12354916B2Method of processing waferDISCO CORP·Filed 2022·Granted Jul 8, 2025·0 cites·4 claims
- 0649US12315716B2Wafer processing methodDISCO CORP·Filed 2022·Granted May 27, 2025·0 cites·4 claims
- 0748US2025239468A1Method of processing waferDISCO CORP·Filed 2025·Application pending·0 cites
- 0843US11471991B2Method of processing workpieceDISCO CORP·Filed 2020·Granted Oct 18, 2022·0 cites·18 claims
- 0940US9586331B2Disk-shaped workpiece dividing methodDISCO CORP·Filed 2014·Granted Mar 7, 2017·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →