Inventor · disambiguated record
Shang-Yun Hou
Also filed as: HOU SHANG Y · HOU SHANG-YUN
241 granted patents·57 pending applications·8,823 citations·filing 1997–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD218TAIWAN SEMICONDUCTOR MFG39JENG SHIN-PUU6YU CHEN-HUA4HSIEH CHENG-CHIEH3
Top patents by PatentIndex Score
298 records- 0199US11852868B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·7 cites·20 claims
- 0299US11493689B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·18 cites·20 claims
- 0399US11417580B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·9 cites·20 claims
- 0499US11222867B1Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·11 cites·20 claims
- 0599US10153222B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·79 cites·20 claims
- 0699US9818720B2Structure and formation method for chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 14, 2017·53 cites·20 claims
- 0799US9806058B2Chip package having die structures of different heights and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·60 cites·20 claims
- 0899US9627365B1Tri-layer CoWoS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·155 cites·20 claims
- 0999US9372206B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·1.8k cites·20 claims
- 1099US9263511B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·1k cites·20 claims
- 1199US8993380B2Structure and method for 3D IC packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 31, 2015·900 cites·22 claims
- 1299US8802504B13D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·408 cites·20 claims
- 1399US8680647B2Packages with passive devices and methods of forming the sameYU CHEN-HUA·Filed 2012·Granted Mar 25, 2014·594 cites·20 claims
- 1498US11728254B2Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·11 cites·20 claims
- 1598US11569156B2Semiconductor device, electronic device including the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·7 cites·20 claims
- 1698US10663512B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·8 cites·14 claims
- 1798US10175294B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·14 cites·20 claims
- 1898US10163856B2Stacked integrated circuit structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·22 cites·19 claims
- 1998US9780072B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 3, 2017·25 cites·20 claims
- 2098US9299649B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 29, 2016·902 cites·22 claims
- 2198US9128123B2Interposer test structures and methodsLIU TZUAN-HORNG·Filed 2011·Granted Sep 8, 2015·31 cites·20 claims
- 2298US9048233B2Package systems having interposersWU WEI-CHENG·Filed 2010·Granted Jun 2, 2015·1.1k cites·19 claims
- 2398US8519537B23D semiconductor package interposer with die cavityJENG SHIN-PUU·Filed 2010·Granted Aug 27, 2013·81 cites·19 claims
- 2498US8105875B1Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2010·Granted Jan 31, 2012·192 cites·13 claims
- 2597US12237288B2Semiconductor die package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·6 cites·20 claims
- 2697US12038599B2Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·3 cites·20 claims
- 2797US11747563B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·2 cites·20 claims
- 2897US11592618B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·3 cites·20 claims
- 2997US11462418B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 4, 2022·5 cites·20 claims
- 3097US11424219B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 3197US10867954B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 15, 2020·14 cites·20 claims
- 3297US10720401B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·18 cites·20 claims
- 3397US10319699B2Chip package having die structures of different heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·21 cites·20 claims
- 3497US9618572B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 11, 2017·9 cites·20 claims
- 3597US9589857B2Interposer test structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 7, 2017·8 cites·20 claims
- 3697US9116203B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 25, 2015·13 cites·20 claims
- 3797US8797057B2Testing of semiconductor chips with microbumpsWU WEI-CHENG·Filed 2011·Granted Aug 5, 2014·17 cites·20 claims
- 3897US6854100B1Methodology to characterize metal sheet resistance of copper damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Feb 8, 2005·313 cites·17 claims
- 3996US11990443B2Semiconductor die package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·4 cites·20 claims
- 4096US11569172B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·3 cites·20 claims
- 4196US11380611B2Chip-on-wafer structure with chiplet interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·4 cites·20 claims
- 4296US11373946B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 4396US11169207B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 9, 2021·3 cites·20 claims
- 4496US11069539B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·3 cites·20 claims
- 4596US10866373B2Optical transceiver and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·9 cites·20 claims
- 4696US10748870B2Tri-layer COWOS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 18, 2020·10 cites·20 claims
- 4796US10535633B2Chip package having die structures of different heights and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·14 cites·20 claims
- 4896US9385095B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·19 cites·20 claims
- 4996US8283781B2Semiconductor device having pad structure with stress buffer layerWU WEI-CHENG·Filed 2010·Granted Oct 9, 2012·33 cites·20 claims
- 5095US11694939B2Semiconductor package, integrated optical communication systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 4, 2023·4 cites·20 claims
Showing the top 50 of 298 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →