Inventor · disambiguated record
Shih-Ping Hsu
Also filed as: HSU SHIH P · HSU SHIH-PING
168 granted patents·108 pending applications·1,581 citations·filing 2001–2025
99Inventor score
Files withPHOENIX PREC TECHNOLOGY CORP102PHOENIX PIONEER TECHNOLOGY CO LTD83HSU SHIH-PING37UNIMICRON TECHNOLOGY CORP19ZHEN DING TECHNOLOGY CO LTD11
Top patents by PatentIndex Score
276 records- 0199US7321164B2Stack structure with semiconductor chip embedded in carrierPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Jan 22, 2008·150 cites·13 claims
- 0298US7639473B2Circuit board structure with embedded electronic componentsPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Dec 29, 2009·121 cites·25 claims
- 0398US7449363B2Semiconductor package substrate with embedded chip and fabrication method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Nov 11, 2008·75 cites·17 claims
- 0498US7312405B2Module structure having embedded chipsPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Dec 25, 2007·83 cites·17 claims
- 0597US11757426B2Manufacturing method for surface acoustic wave filter package structurePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted Sep 12, 2023·3 cites·5 claims
- 0697US7839649B2Circuit board structure having embedded semiconductor element and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Nov 23, 2010·54 cites·14 claims
- 0797US7274099B2Method of embedding semiconductor chip in support platePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Sep 25, 2007·46 cites·4 claims
- 0896US7242092B2Substrate assembly with direct electrical connection as a semiconductor packagePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Jul 10, 2007·49 cites·20 claims
- 0995US11749612B2Semiconductor package devicePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2021·Granted Sep 5, 2023·3 cites·10 claims
- 1095US7485970B2Semiconductor package substrate having contact pad protective layer formed thereonPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Feb 3, 2009·37 cites·5 claims
- 1194US7592706B2Multi-layer circuit board with fine pitches and fabricating method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Sep 22, 2009·13 cites·6 claims
- 1292US7129117B2Method of embedding semiconductor chip in support plate and embedded structure thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Oct 31, 2006·58 cites·19 claims
- 1390US7969745B2Circuit board structure having electronic components integrated thereinUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Jun 28, 2011·21 cites·19 claims
- 1490US7626270B2Coreless package substrate with conductive structuresPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Dec 1, 2009·21 cites·6 claims
- 1590US7359590B2Semiconductor device integrated with optoelectronic componentsPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 15, 2008·20 cites·15 claims
- 1690US7050304B2Heat sink structure with embedded electronic components for semiconductor packagePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted May 23, 2006·64 cites·4 claims
- 1789US10475752B2Semiconductor package structure and method of making the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Nov 12, 2019·5 cites·6 claims
- 1889US7112524B2Substrate for pre-soldering material and fabrication method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Sep 26, 2006·39 cites·3 claims
- 1988US8580608B2Fabrication method of package structure having embedded semiconductor componentUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Nov 12, 2013·8 cites·7 claims
- 2088US7906850B2Structure of circuit board and method for fabricating sameUNIMICRON TECHNOLOGY CORP·Filed 2006·Granted Mar 15, 2011·19 cites·3 claims
- 2188US7382057B2Surface structure of flip chip substratePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Jun 3, 2008·16 cites·8 claims
- 2288US7081402B2Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2003·Granted Jul 25, 2006·34 cites·7 claims
- 2387US8017442B2Method of fabricating a package structureUNIMICRON TECHNOLOGY CORP·Filed 2010·Granted Sep 13, 2011·9 cites·16 claims
- 2487US7453155B2Method for fabricating a flip chip packagePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Nov 18, 2008·15 cites·11 claims
- 2587US7239525B2Circuit board structure with embedded selectable passive components and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Jul 3, 2007·14 cites·19 claims
- 2686US8227711B2Coreless packaging substrate and method for fabricating the sameHSU SHIH-PING·Filed 2010·Granted Jul 24, 2012·7 cites·14 claims
- 2786US7705446B2Package structure having semiconductor chip embedded therein and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Apr 27, 2010·14 cites·7 claims
- 2886US7174630B2Method for fabricating connection terminal of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Feb 13, 2007·15 cites·14 claims
- 2985US9754982B2Packaging module and substrate structure thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Sep 5, 2017·5 cites·20 claims
- 3085US8829356B2Packaging substrate having a passive element embedded therein and method of fabricating the sameHSU SHIH-PING·Filed 2011·Granted Sep 9, 2014·7 cites·7 claims
- 3185US7719104B2Circuit board structure with embedded semiconductor chip and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted May 18, 2010·14 cites·11 claims
- 3285US7656040B2Stack structure of circuit board with semiconductor component embedded thereinPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Feb 2, 2010·14 cites·16 claims
- 3385US7582961B2Package structure with circuits directly connected to semiconductor chipPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Sep 1, 2009·13 cites·18 claims
- 3485US7539022B2Chip embedded packaging structurePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted May 26, 2009·12 cites·9 claims
- 3585US7514786B2Semiconductor chip electrical connection structurePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Apr 7, 2009·13 cites·7 claims
- 3684US9214437B1Package methodPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Dec 15, 2015·6 cites·9 claims
- 3784US8058105B2Method of fabricating a packaging structureHSU SHIH-PING·Filed 2010·Granted Nov 15, 2011·7 cites·7 claims
- 3883US10117340B2Manufacturing method of package substrate with metal on conductive portionsPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2018·Granted Oct 30, 2018·3 cites·5 claims
- 3983US7820233B2Method for fabricating a flip chip substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2006·Granted Oct 26, 2010·13 cites·26 claims
- 4083US7718470B2Package substrate and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted May 18, 2010·11 cites·6 claims
- 4182US8110896B2Substrate structure with capacitor component embedded therein and method for fabricating the sameHSU SHIH-PING·Filed 2006·Granted Feb 7, 2012·10 cites·4 claims
- 4282US8101866B2Packaging substrate with conductive structureHSU SHIH-PING·Filed 2008·Granted Jan 24, 2012·10 cites·17 claims
- 4381US11183447B2Flip-chip package substrate and method for fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Granted Nov 23, 2021·1 cites·10 claims
- 4481US9583436B2Package apparatus and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2015·Granted Feb 28, 2017·5 cites·9 claims
- 4581US7706148B2Stack structure of circuit boards embedded with semiconductor chipsPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 27, 2010·10 cites·11 claims
- 4681US7435618B2Method to manufacture a coreless packaging substratePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Oct 14, 2008·8 cites·11 claims
- 4780US7973398B2Embedded chip package structure with chip support protruding sectionUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Jul 5, 2011·9 cites·12 claims
- 4880US7629204B2Surface roughening method for embedded semiconductor chip structurePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Dec 8, 2009·9 cites·13 claims
- 4980US7508006B2Circuit board structure of integrated optoelectronic componentPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Mar 24, 2009·8 cites·22 claims
- 5079US7839650B2Circuit board structure having embedded capacitor and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Nov 23, 2010·7 cites·16 claims
Showing the top 50 of 276 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Shih-Ping Hsu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →