Inventor · disambiguated record
Sheng Hu
Also filed as: HU SHENG · HU SHENG-HSIUNG
17 granted patents·23 pending applications·52 citations·filing 2005–2024
88Inventor score
Files withWUHAN XINXIN SEMICONDUCTOR MFG32HU SHENG-HSIUNG3INVENTEC APPLIANCES CORP2INVENTEC APPLIANCES PUDONG1Inventec Appliances (Pudong) Corp1
Top patents by PatentIndex Score
40 records- 0189US11791367B2Semiconductor device and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Oct 17, 2023·2 cites·6 claims
- 0286US8256927B2Illumination deviceHU SHENG-HSIUNG·Filed 2009·Granted Sep 4, 2012·43 cites·10 claims
- 0384US10943853B2Semiconductor device and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Mar 9, 2021·4 cites·20 claims
- 0483US11804458B2Method of fabricating integrated circuit deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Oct 31, 2023·1 cites·18 claims
- 0577US11114414B2Wafer structure with capacitive chip interconnection, method for manufacturing the same, and chip structure with capacitive chip interconnectionWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Sep 7, 2021·2 cites·14 claims
- 0677US2023378232A1Semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 0777US2023378233A1Method of fabricating semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 0859US2025174495A1Semiconductor structure with buried power rails and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 0957US2024332079A1Dicing method, bonding method and dieWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 1056US12094704B2Semiconductor device and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Sep 17, 2024·0 cites·9 claims
- 1156US11107856B2Manufacturing method of image sensing deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Aug 31, 2021·0 cites·11 claims
- 1255US12328963B2Semiconductor device and manufacturing method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Granted Jun 10, 2025·0 cites·18 claims
- 1355US2025069966A1C2w structure and method for making sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 1454US12230174B2Method and system for simultaneously displaying data by data classificationINVENTEC APPLIANCES PUDONG·Filed 2023·Granted Feb 18, 2025·0 cites·9 claims
- 1554US2023253439A1Semiconductor device and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 1654US2024153911A1Method for forming semiconductor device and semiconductor device fabricated therebyWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 1753US2024234476A9Image sensor structure and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 1852US2023395440A1Method of handling test pad and method of fabricating semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 1952US2022310682A1Semiconductor device and manufacturing method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 2052US2025135285A1Automatic analysis system and method for fitness trainingINVENTEC APPLIANCES CORP·Filed 2024·Application pending·0 cites
- 2151US2024105532A1Chip packaging method and chip packaging structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 2250US2024194531A1Three-dimensionally integrated structure and method for fabricating sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 2349US12322707B2Large die wafer, large die and method of forming the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
- 2449US10756061B2Multi-layer chip and fabrication method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Aug 25, 2020·0 cites·12 claims
- 2547US12463165B2Bonding structure and manufacturing method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Granted Nov 4, 2025·0 cites·12 claims
- 2647US2011038153A1Led lamp and cooling method thereofHU SHENG-HSIUNG·Filed 2009·Application pending·0 cites
- 2747US2024038631A1Three-dimensional integrated circuit module and fabrication method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Application pending·0 cites
- 2846US11114401B2Bonding structure and method for manufacturing the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Sep 7, 2021·0 cites·12 claims
- 2945US10840085B2Method for improving bonding of dangling bonds of silicon atomsWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Nov 17, 2020·0 cites·10 claims
- 3045US2023170223A1Semiconductor device and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Application pending·0 cites
- 3144US2011032697A1LED lighting device module and LED lighting deviceHU SHENG-HSIUNG·Filed 2009·Application pending·0 cites
- 3243US2024055459A1Semiconductor device and fabrication method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Application pending·0 cites
- 3342US11043448B2Semiconductor device with vertically separated openings and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Jun 22, 2021·0 cites·11 claims
- 3442US2014347841A1Lighting apparatusLITE ON IT CORP·Filed 2014·Application pending·0 cites
- 3541US2007094513A1Data unit protecting method and systemINVENTEC APPLIANCES CORP·Filed 2005·Application pending·0 cites
- 3640US11264242B2Method and apparatus for determining expansion compensation in photoetching process, and method for manufacturing deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Mar 1, 2022·0 cites·10 claims
- 3739US2023163102A1Bonding structure and manufacturing method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Application pending·0 cites
- 3838US2023335504A1Wafer matching design method, wafer bonding structure and chip bonding structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Application pending·0 cites
- 3935US2017163521A1Zigbee network system and the backup method thereofInventec Appliances (Pudong) Corp·Filed 2016·Application pending·0 cites
- 4033US11024534B2Semiconductor device having opening and via hole and method for manufacturing the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Jun 1, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →