Inventor · disambiguated record
Shu-Huei Huang
Also filed as: HUANG SHU H · HUANG SHU-HUEI
4 granted patents·3 pending applications·10 citations·filing 2006–2018
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0180US9343387B2Package on package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 17, 2016·7 cites·16 claims
- 0266US9343421B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 17, 2016·2 cites·2 claims
- 0360US9646921B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 9, 2017·1 cites·7 claims
- 0446US10163662B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·13 claims
- 0545US2018138158A1Fabrication method of package on package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 0642US2016233205A1Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
- 0737US2006266804A1Chip package and wire bonding process thereofWANG CHIN S·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →