Fabrication method of package on package structure

Abstract

A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.

1 - 12  (canceled) 
     
     
         13  A method for fabricating a package on package (PoP) structure, comprising the steps of:
 providing a first packaging substrate having at least a first electronic element and a plurality of first support portions thereon, wherein the first electronic element is electrically connected to the first packaging substrate; 
 forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; 
 forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and 
 providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. 
 
     
     
         14  The method of  claim 13 , wherein the first support portions are electrically connected to the first packaging substrate. 
     
     
         15  The method of  claim 13 , wherein the first support portions are metal posts. 
     
     
         16  The method of  claim 13 , wherein the first support portions are made of copper or a solder material. 
     
     
         17  The method of  claim 13 , wherein the first support portions are copper bumps covered with a solder material. 
     
     
         18  The method of  claim 17 , wherein the copper bumps are of a ball shape or a post shape. 
     
     
         19  The method of  claim 13 , wherein the second support portions are electrically connected to the second packaging substrate. 
     
     
         20  The method of  claim 13 , wherein the second support portions are metal posts. 
     
     
         21  The method of  claim 13 , wherein the second support portions are made of copper or a solder material. 
     
     
         22  The method of  claim 13 , wherein the encapsulant abuts against the second packaging substrate. 
     
     
         23  The method of  claim 13 , wherein a gap is formed between the encapsulant and the second packaging substrate. 
     
     
         24  The method of  claim 13 , further comprising disposing at least a second electronic element on the second packaging substrate.