Inventor · disambiguated record
Lung-Yuan Wang
Also filed as: WANG LUNG Y · WANG LUNG-YUAN
17 granted patents·14 pending applications·38 citations·filing 1993–2024
90Inventor score
Top patents by PatentIndex Score
31 records- 0192US12283560B2Electronic package including electronic structure and electronic body and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Apr 22, 2025·1 cites·10 claims
- 0291US12368116B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jul 22, 2025·2 cites·13 claims
- 0390US11973047B2Electronic package including electronic structure and electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Apr 30, 2024·2 cites·8 claims
- 0485US11152331B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Oct 19, 2021·4 cites·7 claims
- 0580US9343387B2Package on package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 17, 2016·7 cites·16 claims
- 0679US12438079B2Electronic structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·6 claims
- 0779US9356008B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 31, 2016·4 cites·20 claims
- 0876US2024379534A1Electronic package, manufacturing method for the same, and electronic structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0967US11984393B2Electronic package, manufacturing method for the same, and electronic structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted May 14, 2024·0 cites·6 claims
- 1066US9343421B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 17, 2016·2 cites·2 claims
- 1165US12114427B2Method for fabricating assemble substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·11 claims
- 1263US12009340B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·13 claims
- 1360US9646921B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 9, 2017·1 cites·7 claims
- 1460US2025140746A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1554US2024421026A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1653US11382214B2Electronic package, assemble substrate, and method for fabricating the assemble substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Jul 5, 2022·0 cites·8 claims
- 1753US2023178451A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 1852US2023369229A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 1951US2023260886A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 2049US2024055402A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 2146US10163662B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·13 claims
- 2246US5313715AVernier calipers incorporated height gaugeWANG LUNG Y·Filed 1993·Granted May 24, 1994·15 cites·2 claims
- 2345US9905546B2Package on package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 27, 2018·0 cites·8 claims
- 2445US2018138158A1Fabrication method of package on package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 2543US2015054150A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2642US2015102484A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2742US2016233205A1Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
- 2842US2014367850A1Stacked package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2941US10236261B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Mar 19, 2019·0 cites·7 claims
- 3039US2015123287A1Semiconductor package and fabrication method thereof and substrate and packaging structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 3139US2015041972A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →