Inventor · disambiguated record
Shih-Che Huang
Also filed as: HUANG SHIH-CHE
15 granted patents·11 pending applications·12 citations·filing 2006–2025
87Inventor score
Files withUNITED MICROELECTRONICS CORP8TAIWAN SEMICONDUCTOR MFG CO LTD6DU PONT APOLLO LTD3AU OPTRONICS CORP1BURNETT THOMAS LAWRENCE1
Top patents by PatentIndex Score
26 records- 0188US11503204B2Gradient-based exposure and gain control techniquesMAGIC LEAP INC·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 0284US9773860B1Capacitor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 26, 2017·4 cites·16 claims
- 0383US2025343033A1Baffle plate for controlling wafer uniformity and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0482US2025343031A1Devices and methods for controlling wafer uniformity in plasma-based processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0580US11615946B2Baffle plate for controlling wafer uniformity and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 28, 2023·2 cites·20 claims
- 0674US12412734B2Baffle plate for controlling wafer uniformity and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 0772US12463016B2Devices and methods for controlling wafer uniformity in plasma-based processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 0870US10892235B2Die seal ring and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 12, 2021·1 cites·9 claims
- 0969US10978391B2Connection structure of semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 13, 2021·1 cites·8 claims
- 1062US11664333B2Method of manufacturing die seal ringUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 30, 2023·0 cites·8 claims
- 1162US8698150B2Active device, driving circuit structure, and display panelAU OPTRONICS CORP·Filed 2012·Granted Apr 15, 2014·2 cites·47 claims
- 1261US11916018B2Manufacturing method of connection structure of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Feb 27, 2024·0 cites·6 claims
- 1360US11769652B2Devices and methods for controlling wafer uniformity in plasma-based processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 26, 2023·0 cites·18 claims
- 1456US12378415B2High oxygen permeability silicone hydrogel composition, contact lens made from high oxygen permeability silicone hydrogel composition and manufacturing method thereofINNOVA VISION INC·Filed 2022·Granted Aug 5, 2025·0 cites·8 claims
- 1550US12334436B2Metal interconnect structure having serpent metal lineUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 17, 2025·0 cites·13 claims
- 1650US2011012895A1Processing Hogel DataZEBRA IMAGING INC·Filed 2010·Application pending·0 cites
- 1750US2011114178A1Solar cell moduleDU PONT APOLLO LTD·Filed 2010·Application pending·0 cites
- 1850US2011120556A1Thin-Film Photovoltaic CellDU PONT APOLLO LTD·Filed 2010·Application pending·0 cites
- 1950US2011126880A1Thin-Film Photovoltaic Panel and Method of Producing the SameDU PONT APOLLO LTD·Filed 2010·Application pending·0 cites
- 2049US9409147B2Method for granulation of absorbent and adsorbent granules prepared by the sameINER AEC EXECUTIVE YUAN·Filed 2014·Granted Aug 9, 2016·0 cites·12 claims
- 2148US2024145412A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 2246US2009244361A1Camera module for vehicle vision systemMAGNA ELECTRONICS INC·Filed 2006·Application pending·0 cites
- 2342US10185693B2High speed data serialization through hermetic sealsTHORLABS INC·Filed 2016·Granted Jan 22, 2019·0 cites·10 claims
- 2438US2012092232A1Sending Video Data to Multiple Light ModulatorsBURNETT THOMAS LAWRENCE·Filed 2010·Application pending·0 cites
- 2537US2012169763A1Preprocessing a Current Frame According to Next FramesLUCENTE MARK·Filed 2010·Application pending·0 cites
- 2636US2018061752A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →