Inventor · disambiguated record
Shinjae Hwang
Also filed as: HWANG SHINJAE
0 granted patents·4 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withAPPLIED MATERIALS INC4
Top patents by PatentIndex Score
4 records- 0159US2025253192A1Barrier and liner treatment using dual radio frequency capacitive couple plasma for metal interconnectsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0258US2025022750A1Methods of forming interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0356US2024258103A1Plasma treatment of barrier and liner layersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0455US2024071927A1Tantalum doped ruthenium layers for interconnectsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →