Inventor · disambiguated record
Shinya Iida
Also filed as: IIDA SHINYA
20 granted patents·9 pending applications·884 citations·filing 1979–2021
96Inventor score
Top patents by PatentIndex Score
29 records- 0197US4745088AVapor phase growth on semiconductor wafersHITACHI LTD·Filed 1986·Granted May 17, 1988·213 cites·9 claims
- 0294US6106728ASlurry recycling system and method for CMP apparatusFiled 1998·Granted Aug 22, 2000·157 cites·36 claims
- 0388US4581101ADry-etching processASAHI GLASS CO LTD·Filed 1984·Granted Apr 8, 1986·73 cites·9 claims
- 0485US4289188AMethod and apparatus for monitoring etchingHITACHI LTD·Filed 1980·Granted Sep 15, 1981·60 cites·12 claims
- 0584US4267013AMethod for dry-etching aluminum and aluminum alloysHITACHI LTD·Filed 1979·Granted May 12, 1981·48 cites·17 claims
- 0683US5980769APlasma etching methodSPEEDFAM CO LTD·Filed 1997·Granted Nov 9, 1999·35 cites·4 claims
- 0776US6126531ASlurry recycling system of CMP apparatus and method of sameSPEEDFAM CO LTD·Filed 1999·Granted Oct 3, 2000·47 cites·8 claims
- 0874US4427515ASurface acoustic wave device and method for manufacturing the sameHITACHI LTD·Filed 1981·Granted Jan 24, 1984·18 cites·9 claims
- 0973US6159082ASlurry circulation type surface polishing machineFiled 1999·Granted Dec 12, 2000·38 cites·5 claims
- 1070US6306245B1Plasma etching apparatusFiled 1999·Granted Oct 23, 2001·19 cites·4 claims
- 1170US4412119AMethod for dry-etchingHITACHI LTD·Filed 1981·Granted Oct 25, 1983·32 cites·16 claims
- 1268US6360687B1Wafer flattening systemSPEEDFAM IPEC CO LTD·Filed 1999·Granted Mar 26, 2002·38 cites·16 claims
- 1367US6316369B1Corrosion-resistant system and method for a plasma etching apparatusSPEEDFAM CO LTD·Filed 2000·Granted Nov 13, 2001·6 cites·11 claims
- 1466US4308089AMethod for preventing corrosion of Al and Al alloysHITACHI LTD·Filed 1980·Granted Dec 29, 1981·27 cites·14 claims
- 1562US6159388APlasma etching method and plasma etching system for carrying out the sameSPEEDFAM CO LTD·Filed 1998·Granted Dec 12, 2000·26 cites·15 claims
- 1655US6451217B1Wafer etching methodSPEEDFAM IPEC CO LTD·Filed 2000·Granted Sep 17, 2002·5 cites·8 claims
- 1752US6280645B1Wafer flattening process and systemYASUHIRO HORIIKE AND SPEEDFAM·Filed 1999·Granted Aug 28, 2001·17 cites·6 claims
- 1849US2022003183A1Method for predicting combustion state of engineMAZDA MOTOR·Filed 2021·Application pending·0 cites
- 1947US4352974APlasma etcher having isotropic subchamber with gas outlet for producing uniform etchingHITACHI LTD·Filed 1980·Granted Oct 5, 1982·14 cites·23 claims
- 2044US2014216397A1Diesel engineMAZDA MOTOR·Filed 2014·Application pending·0 cites
- 2143US2020011267A1Diesel engineMAZDA MOTOR·Filed 2018·Application pending·0 cites
- 2242US2019360428A1Diesel engineMAZDA MOTOR·Filed 2017·Application pending·0 cites
- 2341US6254718B1Combined CMP and plasma etching wafer flattening systemSPEEDFAM CO LTD·Filed 1999·Granted Jul 3, 2001·9 cites·3 claims
- 2439US2001007275A1Wafer flattening process and systemSPEEDFAM CO LTD·Filed 2001·Application pending·0 cites
- 2539US2020063644A1Diesel engineMAZDA MOTOR·Filed 2016·Application pending·0 cites
- 2638US2020080468A1Diesel engineMAZDA MOTOR·Filed 2016·Application pending·0 cites
- 2735US2002008082A1Local etching apparatus and local etching methodSPEEDFAM CO LTD·Filed 2001·Application pending·0 cites
- 2831US6496748B1Wafer flattening process and storage mediumSPEEDFAM CO LTD·Filed 1999·Granted Dec 17, 2002·2 cites·8 claims
- 2927US2001032705A1Local etching apparatus and local etching methodFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →