Inventor · disambiguated record
Shinobu Isobe
Also filed as: ISOBE SHINOBU
6 granted patents·4 pending applications·16 citations·filing 2002–2007
77Inventor score
Top patents by PatentIndex Score
10 records- 0159US7924042B2Semiconductor device, and design method, inspection method, and design program thereforUMC JAPAN·Filed 2006·Granted Apr 12, 2011·3 cites·4 claims
- 0250US7103864B2Semiconductor device, and design method, inspection method, and design program thereforUMC JAPAN·Filed 2003·Granted Sep 5, 2006·5 cites·3 claims
- 0347US6894389B2Semiconductor device and manufacturing method thereforUMC JAPAN·Filed 2003·Granted May 17, 2005·4 cites·1 claims
- 0445US6881656B1Production process for semiconductor apparatusUMC JAPAN·Filed 2002·Granted Apr 19, 2005·2 cites·12 claims
- 0543US2007224799A1System for making a semiconductor device using bump material including liquidISOBE SHINOBU·Filed 2007·Application pending·0 cites
- 0641US2006231779A1Exterior inspection apparatus and exterior inspection methodUMC JAPAN·Filed 2006·Application pending·0 cites
- 0739US7076747B2Analytical simulator and analytical simulation method and programUMC JAPAN·Filed 2002·Granted Jul 11, 2006·2 cites·8 claims
- 0838US7223682B2Method of making a semiconductor device using bump material including a liquidUMC JAPAN·Filed 2004·Granted May 29, 2007·0 cites·6 claims
- 0933US2003159274A1Bump forming system employing attracting and compressing deviceUMC JAPAN·Filed 2003·Application pending·0 cites
- 1033US2003183931A1Semiconductor apparatus, fixture for measuring characteristics therefor, and semiconductor device characteristics measuring apparatusUMC JAPAN·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →