System for making a semiconductor device using bump material including liquid

Abstract

A system of making a semiconductor device by forming bumps on pads of a test piece which is a semiconductor wafer or chip is disclosed. The system includes a mask substrate having holding holes; a supply portion for supplying a bump material including liquid, which contains a plurality of individual bump materials, to a target face of the mask substrate, so as to make the bump materials be fastened to the holding holes; a compressing plate, provided at the side of the other face of the mask substrate, which can optionally be made to contact with the other face; and a cleaning station for supplying a cleaning liquid or gas to the target face of the mask substrate. After the bump materials are fastened to the holding holes and the target face is cleaned, the bump materials are pressed, together with the mask substrate, onto the pads of the test piece.

1 . A system of making a semiconductor device by forming bumps on pads of a test piece which is a semiconductor wafer or chip, the system comprising: 
 a mask substrate having holding holes;    a supply portion for supplying a bump material including liquid, which contains a plurality of individual bump materials, to a target face of the mask substrate, so as to make the bump materials be fastened to the holding holes;    a compressing plate, provided at the side of the other face of the mask substrate, which can optionally be made to contact with the other face; and    a cleaning station for supplying a cleaning liquid or gas to the target face of the mask substrate,    wherein after the bump materials are fastened to the holding holes and the target face is cleaned, the bump materials are pressed, together with the mask substrate, onto the pads of the test piece.    
   
   
       2 . The system as claimed in  claim 1 , wherein the shape of each bump material is a ball and the thickness of the mask substrate is smaller than the diameter of the ball.  
   
   
       3 . The system as claimed in  claim 1 , further comprising: 
 a vibrating device for vibrating the mask substrate in a direction perpendicular to the thickness direction of the mask substrate, so as to fasten the bump materials to vacant holding holes.